Patents by Inventor Timothy C. Dean

Timothy C. Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Identifying relationships among constituent parts of a wafer fabrication system
    Patent number: 6766212
    Abstract: A method and system for use in wafer fabrication systems. The method and system identify relationships among constituent parts of a wafer fabrication system by generating a presentation of at least one relationship between an identified at least one integral part associated with the wafer fabrication system and at least one other integral part associated with the wafer fabrication system.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: July 20, 2004
    Assignee: NEC Electronics, Inc.
    Inventor: Timothy C. Dean
  • Identifying wafer fabrication system impacts resulting from specified actions
    Patent number: 6728590
    Abstract: A method and system for use in wafer fabrication systems. The method and system identify wafer fabrication system impacts resulting from specified actions by specifying at least one action related to at least one integral part associated with the wafer fabrication system, and generating a presentation of at least one impact upon at least one integral part associated with the wafer fabrication system arising from the at least one action related to the at least one integral part associated with the wafer fabrication system.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: April 27, 2004
    Assignee: NEC Electronics, Inc.
    Inventor: Timothy C. Dean
  • Capturing an evolving wafer fabrication method and system
    Patent number: 6467077
    Abstract: A method and system for use in wafer fabrication systems. The method and system capture an evolving wafer fabrication system by mapping at least one interaction between a selected at least one integral part associated with the wafer fabrication system and at least one other integral part associated with the wafer fabrication system.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: October 15, 2002
    Assignee: NEC Electronics, Inc.
    Inventor: Timothy C. Dean