Abstract: A tandem OLED display is provided, including a substrate backplane, an anode layer, at least two stacked OLED layers, each OLED layer comprising a plurality of pixels, at least one charge generation layer (CGL), wherein each CGL is disposed between two adjacent stacked OLED layers, and a cathode layer. At least one of the CGLs is patterned wherein a pattern provides gaps between each of the plurality of pixels.

Abstract: A tandem OLED device is provided, including an anode, a cathode, at least two electroluminescent units disposed between the anode and the cathode, and an alloy thin film disposed between the two electroluminescent units.

Abstract: Systems and methods for performing direct patterning of a material on a substrate with high fidelity to a desired pattern are presented. A pattern of apertures of a shadow mask is compensated to accommodate a range of propagation angles in a vapor plume used to deposit material onto the substrate through the shadow mask. A shadow mask in accordance with the present disclosure includes an aperture pattern in which aperture position is shifted inward toward the center of the shadow mask by an amount based on the distance of the aperture from the center of the shadow mask. As a result, vaporized material passing through an aperture at a non-normal angle deposits onto the substrate at its proper desired location.

Abstract: A direct patterning deposition mask for OLED deposition is provided where the mask includes a sapphire substrate; and a Silicon Nitride (SiN) membrane. The sapphire substrate thickness may be between 0.7 and 2 mm. The sapphire substrate may have a diameter in the range of 200 mm diameter to 300 mm diameter. Warpage of the substrate is preferably less than <10 um.

Abstract: A system for deposition of evaporated material on a substrate is provided. The substrate has a central axis. The system includes an evaporation vacuum chamber, at least one nozzle assembly, and a shadow mask. The nozzle assembly has a three-point plurality of point evaporation sources disposed adjacent to the central axis of the substrate and at a distance from the substrate whereby the nozzle assembly provides for molecules of evaporated material to arrive at the substrate at an incident angle of less than or equal to 5 degrees.