Patents by Inventor Timothy D. Moser

Timothy D. Moser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator
    Publication number: 20080257862
    Abstract: The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization (“CMP”) of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.
    Type: Application
    Filed: July 2, 2008
    Publication date: October 23, 2008
    Inventors: IRINA BELOV, Timothy D. Moser