Patents by Inventor Timothy D. Sullivan

Timothy D. Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring structure and method of forming the structure
    Patent number: 8569888
    Abstract: Disclosed is a wiring structure and method of forming the structure with a conductive diffusion barrier layer having a thick upper portion and thin lower portion. The thicker upper portion is located at the junction between the wiring structure and the adjacent dielectric materials. The thicker upper portion: (1) minimizes metal ion diffusion and, thereby TDDB; (2) allows a wire width to dielectric space width ratio that is optimal for low TDDB to be achieved at the top of the wiring structure; and (3) provides a greater surface area for via landing. The thinner lower portion: (1) allows a different wire width to dielectric space width ratio to be maintained in the rest of the wiring structure in order to balance other competing factors; (2) allows a larger cross-section of wire to reduce current density and, thereby reduce EM; and (3) avoids an increase in wiring structure resistivity.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: October 29, 2013
    Assignee: International Business Machines Corporation
    Inventors: Fen Chen, Jeffrey P. Gambino, Anthony K. Stamper, Timothy D. Sullivan
  • SEMICONDUCTOR STRUCTURES AND METHODS OF MANUFACTURE
    Publication number: 20130269974
    Abstract: Wire-bonded semiconductor structures using organic insulating material and methods of manufacture are disclosed. The method includes forming a metal wiring layer in an organic insulator layer. The method further includes forming a protective layer over the organic insulator layer. The method further includes forming a via in the organic insulator layer over the metal wiring layer. The method further includes depositing a metal layer in the via and on the protective layer. The method further includes patterning the metal layer with an etch chemistry that is damaging to the organic insulator layer.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy H. DAUBENSPECK, Jeffrey P. GAMBINO, Zhong-Xiang HE, Christopher D. MUZZY, Wolfgang SAUTER, Timothy D. SULLIVAN
  • Self-aligned polymer passivation/aluminum pad
    Patent number: 8546253
    Abstract: The invention provides a semiconductor chip structure having at least one aluminum pad structure and a polyimide buffering layer under the aluminum pad structure, wherein the polyimide buffering layer is self-aligned to the aluminum pad structure, and a method of forming the same. The method includes forming a polyimide buffering layer on a substrate, forming an aluminum pad structure on the buffering layer, and, using the aluminum pad structure as a mask, etching the substrate to remove the polyimide buffering layer from the substrate everywhere except under the aluminum pad structure.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: October 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture
    Patent number: 8541864
    Abstract: A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: September 24, 2013
    Assignee: International Business Machines Corporation
    Inventors: Joseph M. Lukaitis, Jed H. Rankin, Robert R. Robison, Dustin K. Slisher, Timothy D. Sullivan
  • SELF-ALIGNED POLYMER PASSIVATION/ALUMINUM PAD
    Publication number: 20130234316
    Abstract: The invention provides a semiconductor chip structure having at least one aluminum pad structure and a polyimide buffering layer under the aluminum pad structure, wherein the polyimide buffering layer is self-aligned to the aluminum pad structure, and a method of forming the same. The method includes forming a polyimide buffering layer on a substrate, forming an aluminum pad structure on the buffering layer, and, using the aluminum pad structure as a mask, etching the substrate to remove the polyimide buffering layer from the substrate everywhere except under the aluminum pad structure.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 12, 2013
    Applicant: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDER BALL
    Publication number: 20130234329
    Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
    Type: Application
    Filed: April 30, 2013
    Publication date: September 12, 2013
    Applicant: Intetnational Business Machines Corporation
    Inventors: Raschid J. BEZAMA, Timothy H. DAUBENSPECK, Gary LaFONTANT, Ian D. MELVILLE, Ekta MISRA, George J. SCOTT, Krystyna W. SEMKOW, Timothy D. SULLIVAN, Robin A. SUSKO, Thomas A. WASSICK, Xiaojin WEI, Steven L. WRIGHT
  • STRUCTURES AND METHODS FOR DETECTING SOLDER WETTING OF PEDESTAL SIDEWALLS
    Publication number: 20130234315
    Abstract: Structures and methods for detecting solder wetting of pedestal sidewalls. The structure includes a semiconductor wafer having an array of integrated circuit chips, each of the integrated circuit chips having an array of chip pedestals having respective chip solder columns on top of the chip pedestals, the pedestals spaced apart a first distance in a first direction and a spaced apart second distance in second direction perpendicular to the first direction; and at least one monitor structure disposed in different regions of the wafer from the integrated circuit chips, the monitor structure comprising at least a first pedestal and a first solder column on a top surface of the first pedestal and a second pedestal and a second solder column on a top surface of the second pedestal, the first and the second pedestals spaced apart a third distance, the third distance less than the first and the second distances.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 12, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Buffer pad in solder bump connections and methods of manufacture
    Patent number: 8513814
    Abstract: Structures are provided with raised buffer pads for solder bumps. Methods are also provided for forming the raised buffer pads for solder bumps. The method includes forming a raised localized buffer pad structure on a tensile side of a last metal layer of a solder bump connection. The raised localized buffer pad structure increases a height of a portion of a pad structure of the solder bump connection with respect to a compressive side of the last metal layer.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: August 20, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump
    Patent number: 8508043
    Abstract: A topographical feature is formed proximate to a conductive bond pad that is used to couple a solder bump to a semiconductor die. The topographical feature is separated from the conductive bond pad by a gap. In one embodiment, the topographical feature is formed at a location that is slightly beyond the perimeter of the solder bump, wherein an edge of the bump is aligned vertically to coincide with the gap separating the conductive bond pad from the topographical feature. The topographical feature provides thickness enhancement of a non-conductive layer disposed over the semiconductor die and the conductive bond pad and stress buffering.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: August 13, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan
  • INDUCTORS AND WIRING STRUCTURES FABRICATED WITH LIMITED WIRING MATERIAL
    Publication number: 20130200521
    Abstract: Back-end-of-line (BEOL) wiring structures and inductors, methods for fabricating BEOL wiring structures and inductors, and design structures for a BEOL wiring structure or an inductor. A feature, which may be a trench or a wire, is formed that includes a sidewall intersecting a top surface of a dielectric layer. A surface layer is formed on the sidewall of the feature. The surface layer is comprised of a conductor and has a thickness selected to provide a low resistance path for the conduction of a high frequency signal.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 8, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hanyi Ding, Jeffrey P. Gambino, Zhong-Xiang He, Alvin J. Joseph, Anthony K. Stamper, Timothy D. Sullivan
  • ON-CHIP POLY-TO-CONTACT PROCESS MONITORING AND RELIABILITY EVALUATION SYSTEM AND METHOD OF USE
    Publication number: 20130191047
    Abstract: An on-chip poly-to-contact process monitoring and reliability evaluation system and method of use are provided. A method includes determining a breakdown electrical field of each of one or more shallow trench isolation (STI) measurement structures corresponding to respective one or more original semiconductor structures. The method further includes determining a breakdown voltage of each of one or more substrate measurement structures corresponding to the respective one or more original semiconductor structures. The method further includes determining a space between a gate and a contact of each of the one or more original semiconductor structures based on the determined breakdown electrical field and the determined breakdown voltage.
    Type: Application
    Filed: January 20, 2012
    Publication date: July 25, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Fen CHEN, Roger A. DUFRESNE, Timothy D. SULLIVAN, Yanfeng WANG
  • Thin film resistors and methods of manufacture
    Patent number: 8486796
    Abstract: A method of forming a semiconductor structure includes: forming a resistor over a substrate; forming at least one first contact in contact with the resistor; and forming at least one second contact in contact with the resistor. The resistor is structured and arranged such that current flows from the at least one first contact to the at least one second contact through a central portion of the resistor. The resistor includes at least one extension extending laterally outward from the central portion in a direction parallel to the current flow. The method includes sizing the at least one extension based on a thermal diffusion length of the resistor.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: July 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: David L. Harmon, Joseph M. Lukaitis, Stewart E. Rauch, III, Robert R. Robison, Dustin K. Slisher, Jeffrey H. Sloan, Timothy D. Sullivan, Kimball M. Watson
  • Micro-electro-mechanical-system temperature sensor
    Patent number: 8480302
    Abstract: The present invention provides a micro-electro-mechanical-system (MEMS) temperature sensor that employs a suspended spiral comprising a material with a positive coefficient of thermal expansion. The thermal expansion of the suspended spiral is guided to by a set of guideposts to provide a linear movement of the free end of the suspended spiral, which is converted to an electrical signal by a set of conductive rotor azimuthal fins that are interdigitated with a set of conductive stator azimuthal fins by measuring the amount of capacitive coupling therebetween. Real time temperature may thus be measured through the in-situ measurement of the capacitive coupling. Optionally, the MEMS temperature sensor may have a ratchet and a pawl to enable ex-situ measurement.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: July 9, 2013
    Assignee: International Business Machines Corporation
    Inventors: Jason P. Gill, David L. Harmon, Timothy D. Sullivan
  • Structures and methods to reduce maximum current density in a solder ball
    Patent number: 8446006
    Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: May 21, 2013
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott, Krystyna W. Semkow, Timothy D. Sullivan, Robin A. Susko, Thomas A. Wassick, Xiaojin Wei, Steven L. Wright
  • METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN ELECTRICAL INTERCONNECTION OF SEMICONDUCTOR DIE TO SEMICONDUCTOR CHIP PACKAGE SUBSTRATE WITH SOLDER BUMP
    Publication number: 20130119534
    Abstract: A topographical feature is formed proximate to a conductive bond pad that is used to couple a solder bump to a semiconductor die. The topographical feature is separated from the conductive bond pad by a gap. In one embodiment, the topographical feature is formed at a location that is slightly beyond the perimeter of the solder bump, wherein an edge of the bump is aligned vertically to coincide with the gap separating the conductive bond pad from the topographical feature. The topographical feature provides thickness enhancement of a non-conductive layer disposed over the semiconductor die and the conductive bond pad and stress buffering.
    Type: Application
    Filed: November 16, 2011
    Publication date: May 16, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan
  • Polymer and solder pillars for connecting chip and carrier
    Patent number: 8426247
    Abstract: A method of connecting chips to chip carriers, ceramic packages, etc. (package substrates) forms smaller than usual first solder balls and polymer pillars on the surface of a semiconductor chip and applies adhesive to the distal ends of the polymer pillars. The method also forms second solder balls, which are similar in size to the first solder balls, on the corresponding surface of the package substrate to which the chip will be attached. Then, the method positions the surface of the semiconductor chip next to the corresponding surface of the package substrate. The adhesive bonds the distal ends of the polymer pillars to the corresponding surface of the package substrate. The method heats the first solder balls and the second solder balls to join the first solder balls and the second solder balls into solder pillars.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: April 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Underfill flow guide structures and method of using same
    Patent number: 8409980
    Abstract: Underfill flow guide structures and methods of using the same are provided with a module. The method includes mounting bumps on a substrate. The method also includes forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance. The underfill flow guide structures are integrated with the substrate and formed between adjacent bumps. The underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: April 2, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan
  • IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods
    Patent number: 8350383
    Abstract: An IC chip package, in one embodiment, may include an IC chip including an upper surface including an overhang extending beyond a sidewall of the IC chip, and underfill material about the sidewall and under the overhang. The overhang prevents underfill material from extending over an upper surface of the IC chip. In another embodiment, a ball grid array (BGA) is first mounted to landing pads on a lower of two joined IC chip packages. Since the BGA is formed on the lower IC chip package first, the BGA acts as a dam for the underfill material thereon. The underfill material extends about the respective IC chip and surrounds a bottom portion of a plurality of solder elements of the BGA and at least a portion of respective landing pads thereof.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: January 8, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
  • Solder interconnect pads with current spreading layers
    Patent number: 8338947
    Abstract: Structure and methods of making the structures. The structures include a structure, comprising: an organic dielectric passivation layer extending over a substrate; an electrically conductive current spreading pad on a top surface of the organic dielectric passivation layer; an electrically conductive solder bump pad comprising one or more layers on a top surface of the current spreading pad; and an electrically conductive solder bump containing tin, the solder bump on a top surface of the solder bump pad, the current spreading pad comprising one or more layers, at least one of the one or more layers consisting of a material that will not form an intermetallic with tin or at least one of the one or more layers is a material that is a diffusion barrier to tin and adjacent to the solder bump pad.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: December 25, 2012
    Assignee: Ultratech, Inc.
    Inventors: Timothy H. Daubenspeck, Timothy D. Sullivan
  • COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE
    Publication number: 20120313215
    Abstract: A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
    Type: Application
    Filed: August 17, 2012
    Publication date: December 13, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joseph M. LUKAITIS, Jed H. RANKIN, Robert R. ROBISON, Dustin K. SLISHER, Timothy D. SULLIVAN