Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: Systems, apparatuses and methods may provide for an electronic spine and one or more digital pages removably attached to the electronic spine, wherein the one or more digital pages include a first side with a first flexible display and a second side with a second flexible display. In one example, the system may further include a magnetic interface, wherein the digital page is removably attached to the electronic spine via the magnetic interface.

Abstract: A system board is provided that includes a connector. The connector includes a pinfield. The pinfield includes a set of differential signal conductors to correspond to pins of a set of differential signaling pairs; a set of one or more auxiliary signal conductors to carry auxiliary signals; and a plurality of thru-hole ground vias adjacent to a particular one of the auxiliary signal conductors in the set of auxiliary signal conductors. A method for improving signal integrity in a computer interconnect can include carrying differential signals on a set of differential signal vias in a connector pinfield; carrying sideband signals on a set of sideband vias in the connector pinfield; and reducing via-to-via crosstalk between a particular one of the sideband vias and one of the differential signal vias through one or more thru-hole ground vias adjacent to the particular sideband via in the pinfield.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: A system board is provided that includes a connector. The connector includes a pinfield. The pinfield includes a set of differential signal conductors to correspond to pins of a set of differential signaling pairs; a set of one or more auxiliary signal conductors to carry auxiliary signals; and a plurality of thru-hole ground vias adjacent to a particular one of the auxiliary signal conductors in the set of auxiliary signal conductors.

Abstract: A circuit board is provided including a top ground plane, a bottom ground plane, and a pin field of a connector with a plurality of pins that includes a plurality of differential pin pairs, one or more ground pins, and one or more sideband pins. At least a particular one of the sideband pins is positioned within the pin field adjacent to a first pin of a first one of the differential pin pairs. One or more ground vias are provided on the circuit board positioned to correspond to the particular sideband pin.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: Systems, apparatuses and methods may provide for an electronic spine and one or more digital pages removably attached to the electronic spine, wherein the one or more digital pages include a first side with a first flexible display and a second side with a second flexible display. In one example, the system may further include a magnetic interface, wherein the digital page is removably attached to the electronic spine via the magnetic interface.

Abstract: Embodiments of the invention describe apparatuses, systems and method for utilizing testing instruments having electrical interconnects formed from High Density Interconnect (HDI) multi-layer substrates. Electrical signals may be routed between devices mounted on HDI substrates by way of conductive interconnects formed within their multiple layers. The conductive interconnects are generally comprised of metal interconnects and vias, where each via penetrates between layers to couple a metal interconnect from one layer to a metal interconnect from another layer. By utilizing HDI substrates, embodiments of the invention enable “breaking out” the signal pins on multiple layers, perhaps double or triple the routing layers of the package channel; however, the geometry of the transmission lines and other factors may be chosen to ensure channel parameters such as impedance and crosstalk closely emulate the final device package.

Abstract: A circuit board is provided including a top ground plane, a bottom ground plane, and a pin field of a connector with a plurality of pins that includes a plurality of differential pin pairs, one or more ground pins, and one or more sideband pins. At least a particular one of the sideband pins is positioned within the pin field adjacent to a first pin of a first one of the differential pin pairs. One or more ground vias are provided on the circuit board positioned to correspond to the particular sideband pin.

Abstract: Techniques for reducing resonance in contact fingers of a connector are described herein. An example of a device in accordance with the present techniques includes an add-in-card that includes a circuit board and an edge contact finger disposed on an outer surface of the circuit board. The add-in-card also includes a resonator disposed in an internal layer of the circuit board and coupled to the edge contact finger, wherein the resonator reduces a resonance in the edge contact finger.

Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.

Abstract: Techniques for reducing resonance in contact fingers of a connector are described herein. An example of a device in accordance with the present techniques includes an add-in-card that includes a circuit board and an edge contact finger disposed on an outer surface of the circuit board. The add-in-card also includes a resonator disposed in an internal layer of the circuit board and coupled to the edge contact finger, wherein the resonator reduces a resonance in the edge contact finger.

Abstract: Embodiments of the invention describe apparatuses, systems and method for utilizing testing instruments having electrical interconnects formed from High Density Interconnect (HDI) multi-layer substrates. Electrical signals may be routed between devices mounted on HDI substrates by way of conductive interconnects formed within their multiple layers. The conductive interconnects are generally comprised of metal interconnects and vias, where each via penetrates between layers to couple a metal interconnect from one layer to a metal interconnect from another layer. By utilizing HDI substrates, embodiments of the invention enable “breaking out” the signal pins on multiple layers, perhaps double or triple the routing layers of the package channel; however, the geometry of the transmission lines and other factors may be chosen to ensure channel parameters such as impedance and crosstalk closely emulate the final device package.

Abstract: At least two sequences of predetermined reference times are established on respective ones of at least two communication lines. At least some of the reference times of at least one of the sequences occur out-of-phase with at least some of the reference times of another of the sequences. Digital data is encoded onto data signals on one or more communication lines such that a time difference between at least one of the data signals and the nearest one of the reference times on one of the communication lines is smaller than the time difference between the same data signal and the nearest one of the reference times on another one of the communication lines.