Patents by Inventor Timothy Daniel Lyons

Timothy Daniel Lyons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pocketed circuit board
    Patent number: 9786977
    Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 10, 2017
    Assignee: Teradyne, Inc.
    Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell
  • Multi-stage equalization
    Patent number: 9772378
    Abstract: An example apparatus for interfacing between automatic test equipment (ATE) and a device under test (DUT) includes: multiple stages arranged in sequence between the ATE and the DUT, where each of the multiple stages includes a driver, at least two of the multiple stages each includes a filter, each filter is arranged between two drivers, and each filter is configured to reduce jitter produced by a preceding driver in a signal transmitted between the ATE and the DUT.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: September 26, 2017
    Assignee: Teradyne, Inc.
    Inventor: Timothy Daniel Lyons
  • Pocketed Circuit Board
    Publication number: 20170170537
    Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 15, 2017
    Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell
  • Multi-Stage Equalization
    Publication number: 20160061926
    Abstract: An example apparatus for interfacing between automatic test equipment (ATE) and a device under test (DUT) includes: multiple stages arranged in sequence between the ATE and the DUT, where each of the multiple stages includes a driver, at least two of the multiple stages each includes a filter, each filter is arranged between two drivers, and each filter is configured to reduce jitter produced by a preceding driver in a signal transmitted between the ATE and the DUT.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 3, 2016
    Inventor: Timothy Daniel Lyons