Patents by Inventor Timothy David Heidel

Timothy David Heidel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11908593
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: February 20, 2024
    Assignee: VEIR, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Publication number: 20230386705
    Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.
    Type: Application
    Filed: January 10, 2023
    Publication date: November 30, 2023
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Publication number: 20230269907
    Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.
    Type: Application
    Filed: November 21, 2022
    Publication date: August 24, 2023
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Publication number: 20230223170
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Application
    Filed: November 22, 2022
    Publication date: July 13, 2023
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Patent number: 11581109
    Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: February 14, 2023
    Assignee: Veir, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Patent number: 11540419
    Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: December 27, 2022
    Assignee: Veir, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Patent number: 11538607
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: December 27, 2022
    Assignee: Veir, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Publication number: 20220277873
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 1, 2022
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Publication number: 20220272867
    Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.
    Type: Application
    Filed: May 12, 2022
    Publication date: August 25, 2022
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Publication number: 20220254550
    Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.
    Type: Application
    Filed: November 11, 2021
    Publication date: August 11, 2022
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Patent number: 11373784
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: June 28, 2022
    Assignee: Veir, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Patent number: 11363741
    Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: June 14, 2022
    Assignee: Veir, Inc.
    Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
  • Publication number: 20220159873
    Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 19, 2022
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
  • Publication number: 20220157495
    Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 19, 2022
    Applicant: VEIR, Inc.
    Inventors: Stephen Paul Ashworth, Franco Mariconi, Timothy David Heidel