Abstract: A computerised method—and related apparatus, systems, programs for a computer and signals—for securely communicating an electronic document between high and low security domains where the data format of the document is not in a predetermined set of simple data formats (for example bitmap images or ASCII text), the document is automatically converted to a data format in the set. Optionally a “lossy” transformation may also be applied to further confound attackers. The document is then conveyed securely to a user sanction function for review and sanction by a human user. Once sanctioned the document is digitally signed for onward transmission to the recipient. Especially for transmission from low domain to high domain, user sanctioning of document release may be omitted.

Abstract: This invention relates in general to vibroseis and, more specifically, but not by way of limitation, to the enhancement and/or signal strength optimization of low frequency content of seismic signals for use in surveying boreholes and/or subsurface earth formations. In embodiments of the present invention, physical properties of a seismic vibrator may be analyzed and used to provide for determination of a driving force necessary to drive a reaction mass to produce a sweep signal with enhanced low frequency content for injection into the ground for vibroseis. In certain aspects, the physical properties may be considered independent of any geophysical properties related to operation of the seismic vibrator.

Abstract: In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Abstract: An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

Abstract: A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm2).

Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.

Abstract: In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Abstract: The invention provides a method of plating an integrated circuit. An activation plate is positioned adjacent to at least one integrated circuit. The integrated circuit includes a plurality of bond pads comprising a bond-pad metal, and the activation plate also comprises the bond-pad metal. A layer of electroless nickel is plated on the bond pads and the activation plate, and a layer of gold is plated over the layer of electroless nickel on the bond pads and the activation plate. An integrated circuit with bond pads plated using the activation plate, and a system for plating an integrated circuit is also disclosed.

Abstract: The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.

Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.

Abstract: The present invention provides shelf-stable shredded cheeses and methods of preparing such shelf-stable shredded cheeses using a combination of a natural or process cheese, a cheese powder, glycerin, and a filler. The shredded cheeses of this invention are shelf-stable at ambient temperatures, have good organoleptic properties, and exhibit good melt restriction and essentially no browning upon melting. The shredded cheeses of this invention are especially adapted for incorporated into, or use on or with, snack foods (e.g., chips) for retail sale which can be stored at ambient temperatures.

Abstract: An air bag calibrator that is used to calibrate a plurality of seat sensors within a seat simultaneously. The calibrator uses controlled pressure contained within an air bladder and an air press cylinder to apply a controlled force across an entire seat surface that actuates all of the seat sensors in a consistent and repeatable manner, a major improvement over existing seat calibration methods. This is accomplished by loading a seat onto the calibrator, recording a baseline seat sensor value for each of the seat sensors, extending the air press cylinder to an extended position and applying a controlled force across the entire seat surface. The air pressure in the air bladder is then increased or decreased to a target pressure for a predetermined time, at which time an actuated seat sensor values for each of the seat sensors is recorded.

Abstract: A switching system that incorporates a user interface allowing the operator to see all levels of a multi-level menu simultaneously is disclosed. In particular, the user interface includes a rotary knob, an alphanumeric display and one or more keypad switches or push-buttons. The alphanumeric display of the system includes one or more lines arranged one above the other, thereby allowing all levels of a menu to be simultaneously visible. In addition, the keypad switches are arranged so that each switch is associated with one line of the display.

Abstract: An electrical control popout actuator mechanism preferably integrated with a trimmer potentiometer is vertically mounted directly to a printed circuit board. The electrical control popout actuator mechanism has a cam cylinder member, a spring biasing member, a shaft member, and a follower member which allow it to extend during use and retract when not in use. Flanges on said follower member follow cooperating cam paths to allow activation of the mechanism.

Abstract: A trailer includes a deck assembly with parallel longitudinal sides, a plurality of wheels supporting the deck assembly, and a bracket insert releasably attached to the deck assembly. The bracket insert includes a retaining clip securing an elongated conduit.

Abstract: A door bumper assembly for an automotive vehicle sliding door has an adjustable bumper head with a door face for mating with a door inner surface when the door is in a closed position to provide a predetermined lateral load to the door. A bumper base is mounted between the bumper head and a vehicle body surface at a rearward end of a door track and has a hinge face for contacting a door hinge to prevent door rearward longitudinal movement when the door is moved to a fully open position. A bolt threaded on both ends is attached on a first end to the bumper head to allow lateral adjustment with respect to the bumper base, and passes through the bumper base for attachment on a second end to a vehicle body portion.

Abstract: A system for analyzing a sample is disclosed. The system includes a light-transmitting probe with a light emitting tip having a diameter that is less than one-wavelength of light. The system is adapted to place the probe in close proximity to the sample without physically contacting the sample with the probe, and to move the sample relative to the probe such that light transmitted from the probe is directed onto the desired portion of the sample surface. The system further include a light source which transmits light into the probe tip. The system also includes a detector which detects a portion of the light transmitted through the sample. The detector is configured to detect that portion of the light that was incident on the sample surface at an angle greater than the critical angle. The detector is equipped with an aperture through which passes substantially all of the light that was incident on the surface at an angle less than the critical angle and which was transmitted through the sample.

Abstract: Quantum carrier confinement in a wire-like region defined by intersecting layers is significantly enhanced by various structural modifications of a conventional quantum wire device. In that way, operation of the device at room temperature and above is made feasible.