Abstract: In an embodiment, a power amplifier (PA) includes a signal processing path including gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, sensors coupled to the signal processing path each to sense a characteristic of operation of the PA, and a microcontroller configured to execute instructions and to receive the operation characteristic(s) and to control one or more parameters of the signal processing path responsive this operation characteristic.

Abstract: A power amplifier includes a power amplifier core including a plurality of gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, an output network coupled to the power amplifier core to receive the amplified RF signal and output a transmit output power signal, and a directional coupler coupled to the output network to obtain a coupled signal proportional to the transmit output power signal. Each of these components can be configured on a single semiconductor die, in an embodiment.

Abstract: A power amplifier includes a power amplifier core including a plurality of gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, an output network coupled to the power amplifier core to receive the amplified RF signal and output a transmit output power signal, and a directional coupler coupled to the output network to obtain a coupled signal proportional to the transmit output power signal. Each of these components can be configured on a single semiconductor die, in an embodiment.

Abstract: In an embodiment, a power amplifier (PA) includes a signal processing path including gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, sensors coupled to the signal processing path each to sense a characteristic of operation of the PA, and a microcontroller configured to execute instructions and to receive the operation characteristic(s) and to control one or more parameters of the signal processing path responsive this operation characteristic.

Abstract: An isolator that includes first and second substantially identical circuitry galvanically isolated from each other and each having at least one communications channel thereon for communicating signals across an isolation boundary therebetween and each of said first and second circuitry having configurable functionality associated with the operation thereof. A coupling device is provided for coupling signal across the isolation boundary between the at least one communication channels of the first and second circuitry. First and second configuration memories are provided, each associated with a respective one of the first and second circuitry. First and second configuration control devices are provided, each associated with a respective one of the first and second circuitry and each configuring the functionality of the associated one of the first and second circuitry.

Abstract: An apparatus comprising a functional circuitry on a first die. Said function circuitry configured to drive an RF voltage isolation link with an RF signal responsive to receipt of a logic signal at a first logic state. Control circuitry modifies the frequency of the RF signal to spread harmonics to other than a fundamental frequency.

Abstract: An integrated circuit provides high voltage isolation capabilities. The circuit includes a first area containing a first group of functional circuitry located in a substrate of the integrated circuit. This circuit also includes a second area containing a second group of functional circuitry also contained within the substrate of the integrated circuit. Capacitive isolation circuitry located in the conductive layers in the integrated circuit provide a high voltage isolation link between the first group of functional circuitry and the second group of functional circuitry. The capacitive isolation circuitry distributes a first portion of the high voltage isolation signal across the first group of capacitors in the capacitive isolation circuitry and distributes a second portion of the high voltage isolation circuitry across the second group of capacitors in the capacitive isolation circuitry.

Abstract: An integrated circuit having voltage isolation capabilities includes a first area of the integrated circuit containing functional circuitry that is located in the substrate of the integrated circuit. A second area of the integrated circuit contains an integrated RF isolation circuitry for voltage isolating the functional circuitry. The RF isolation circuitry is located in the metal layers of the integrated circuit.

Abstract: An isolator provides bidirectional data transfer for a plurality of communications channels. First and second dies are located on first and second sides of a voltage isolation barrier and have a first and second plurality of digital data input/output pins associated therewith. First circuitry on the first die and third circuitry on the second die serializes a plurality of parallel digital data inputs from the digital data input/output pins onto one link across the barrier and transmits synchronization clock signals associated with the digital data inputs over a link across the barrier. Second circuitry on the second die and fourth circuitry on the first die de-serializes the digital data inputs from the first link onto the second digital data input/output pins and receives the first synchronization clock signal associated with the digital data inputs on the second link.

Abstract: A circuit package providing voltage isolation includes at least one output and first circuitry located in a substrate of the circuit package for performing an operation. A transformer located in the metal layers of the circuit package provides voltage isolation between the first circuitry and the at least one output.

Abstract: A system for providing multiple communication channels over a single voltage isolation link includes first circuitry for multiplexing a plurality of digital data inputs from a plurality of communication channels onto the single voltage isolation link. Second circuitry de-multiplexes the plurality of digital data inputs from the single voltage isolation link to the plurality of communication channels. An RF isolator is used for providing the single voltage isolation link.

Abstract: An apparatus comprising a functional circuitry on a first die. Said function circuitry configured to drive an RF voltage isolation link with an RF signal responsive to receipt of a logic signal at a first logic state. Control circuitry modifies the frequency of the RF signal to spread harmonics to other than a fundamental frequency.

Abstract: An isolator that includes first and second substantially identical circuitry galvanically isolated from each other and each having at least one communications channel thereon for communicating signals across an isolation boundary therebetween and each of said first and second circuitry having configurable functionality associated with the operation thereof. A coupling device is provided for coupling signal across the isolation boundary between the at least one communication channels of the first and second circuitry. First and second configuration memories are provided, each associated with a respective one of the first and second circuitry. First and second configuration control devices are provided, each associated with a respective one of the first and second circuitry and each configuring the functionality of the associated one of the first and second circuitry.

Abstract: An apparatus comprising a functional circuitry on a first die. Said function circuitry configured to drive an RF voltage isolation link with an RF signal responsive to receipt of a logic signal at a first logic state. Control circuitry modifies the frequency of the RF signal to spread harmonics to other than a fundamental frequency.

Abstract: An integrated circuit isolator for providing data transfer of digital data signals across a voltage isolation barrier includes an integrated circuit package having a first plurality of input data pins on one side of the isolation barrier and a corresponding plurality of output data pins on the other side of the isolation boundary. First circuitry is associated with the first plurality of input data pins and second circuitry is associated with the plurality of output data pins. A communications interface provides across the voltage isolation barrier a first communications channel for communicating data from the first circuitry to the second circuitry and a second communications channel for communicating synchronization clock data from the first circuitry to the second circuitry.

Abstract: An integrated circuit provides high voltage isolation capabilities. The circuit includes a first area containing a first group of functional circuitry located in a substrate of the integrated circuit. This circuit also includes a second area containing a second group of functional circuitry also contained within the substrate of the integrated circuit. Capacitive isolation circuitry located in the conductive layers in the integrated circuit provide a high voltage isolation link between the first group of functional circuitry and the second group of functional circuitry. The capacitive isolation circuitry distributes a first portion of the high voltage isolation signal across the first group of capacitors in the capacitive isolation circuitry and distributes a second portion of the high voltage isolation circuitry across the second group of capacitors in the capacitive isolation circuitry.

Abstract: A circuit package for providing isolation between a controller on a first side of a switched power supply and a second side of the switched power supply. An isolation link provides voltage isolation between the first and second sides and includes on the first sides circuitry for transmitting a driver signal received from the controller and circuitry for receiving a voltage feedback signal responsive to a sensed output voltage on the second side. The second side includes circuitry for receiving the driver signal and also circuitry for transmitting the voltage feedback signal. A driver located on the second side is responsive to the received driver signal. The second side further includes circuitry for sensing the output voltage and generating the voltage feedback signal. The isolation link additionally provides voltage isolation between the controller and the driver circuit and between the controller and the sensed output voltage.

Abstract: An integrated circuit having voltage isolation capabilities includes a first area of the integrated circuit containing functional circuitry that is located in the substrate of the integrated circuit. A second area of the integrated circuit contains an integrated RF isolation circuitry for voltage isolating the functional circuitry. The RF isolation circuitry is located in the metal layers of the integrated circuit.

Abstract: An integrated circuit single chip isolator provides bidirectional data transfer for a plurality of communications channels. A first and second dies are located on a first and second sides of a voltage isolation barrier in the chip and have a first and second plurality of digital data input/output pins associated therewith. First circuitry located on the first die on a first side of the voltage isolation barrier and third circuitry located on the second die on a second side of the voltage isolation barrier serializes a plurality of parallel digital data inputs from the associated plurality of digital data input/output pins onto a one link across the voltage isolation barrier and transmits synchronization clock signals associated with the plurality of digital data inputs over a another link across the voltage isolation barrier.

Abstract: An integrated circuit having voltage isolation capabilities includes a first area of the integrated circuit containing functional circuitry that is located in the substrate of the integrated circuit. A second area of the integrated circuit contains an integrated RF isolation circuitry for voltage isolating the functional circuitry. The RF isolation circuitry is located in the metal layers of the integrated circuit.