Patents by Inventor Timothy E. Antesberger

Timothy E. Antesberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Material separation to form segmented product
    Patent number: 6958106
    Abstract: A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: October 25, 2005
    Assignee: Endicott International Technologies, Inc.
    Inventors: Timothy E. Antesberger, John S. Kresge
  • Material separation to form segmented product
    Publication number: 20040201136
    Abstract: A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
    Type: Application
    Filed: April 9, 2003
    Publication date: October 14, 2004
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Timothy E. Antesberger, John S. Kresge