Abstract: A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection device includes forming a trench in the second side of the fluid ejection device, depositing a conductive material in the trench, forming a first opening in the fluid ejection device between the first side of the fluid ejection device and the conductive material in the trench, depositing a conductive material in the first opening, and forming a conductive path between the conductive material in the first opening and a wiring line of one of the drop ejecting elements.

Abstract: An optical microelectromechanical system (MEMS) device and a method for making it are disclosed. The device generally includes a substrate with two or more device dies attached to the substrate. Each device die includes one or more MEMS optical elements. A common clamping die is attached to the device dies such that each MEMS optical element aligns with a corresponding clamping surface on the common clamping die. The single larger clamping die, which covers all the elements on the smaller device dies, forces mirrors contained thereon to register accurately, in the “ON” state. Such a device may be made by attaching two or more device dies to a substrate, and attaching a common clamping die to the two or more device dies. The device dies may be attached to the substrate before attaching the common clamping die to the device dies. Alternatively, the common clamping die may be attached to the device dies before the device dies are attached to the substrate.

Abstract: Disclosed is an apparatus and method for detecting whether rotatable MEMS elements are in the “on” or “off” position. Embodiments of the invention have application in devices switches that employ mirrors that move between an “on” or “off” position, wherein they reflect light from an input fiber into an output fiber in the “on” position, and allow the light to pass in the “off” position. Electrodes are positioned in the device such that the mirrors are close to, and therefor capacitively coupled to, a different electrode depending on whether they are in the “on” or “off” position. This invention is especially useful for switches that already employ electrodes for electrostatic clamping of mirrors in one or more positions, since those same electrodes can be used both to electrostatically clamp the mirrors and to sense their position.

Abstract: A fluid ejection assembly includes a platform having a fluid inlet, a fluid outlet, a plurality of fluid feed slots, and a fluid manifold defined therein, and a plurality of fluid ejection devices each mounted on the platform and including an array of drop ejecting elements and a fluid refill slot communicating with the array of drop ejecting elements. The fluid refill slot of each of the fluid ejection devices communicates with at least one of the fluid feed slots of the platform, and the fluid manifold of the platform fluidically couples each of the fluid feed slots with the fluid inlet and the fluid outlet of the platform.

Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.

Abstract: A flextensional transducer includes a substrate having an etch stop layer interposed between a first layer and a second layer, a flexible membrane supported by the second layer of the substrate and having an orifice defined therein, and an actuator provided on the flexible membrane and adapted to deflect the flexible membrane. The substrate has an opening formed through the first layer and a hole formed through the etch stop layer and the second layer such that the hole through the etch stop layer and the second layer of the substrate communicates with the opening through the first layer of the substrate and the orifice in the flexible membrane.

Abstract: A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection device includes forming a trench in the second side of the fluid ejection device, depositing a conductive material in the trench, forming a first opening in the fluid ejection device between the first side of the fluid ejection device and the conductive material in the trench, depositing a conductive material in the first opening, and forming a conductive path between the conductive material in the first opening and a wiring line of one of the drop ejecting elements.

Abstract: An optical microelectromechanical system (MEMS) device and a method for making it are disclosed. The device generally includes a substrate with two or more device dies attached to the substrate. Each device die includes one or more MEMS optical elements. A common clamping die is attached to the device dies such that each MEMS optical element aligns with a corresponding clamping surface on the common clamping die. The single larger clamping die, which covers all the elements on the smaller device dies, forces mirrors contained thereon to register accurately, in the “ON” state. Such a device may be made by attaching two or more device dies to a substrate, and attaching a common clamping die to the two or more device dies. The device dies may be attached to the substrate before attaching the common clamping die to the device dies. Alternatively, the common clamping die may be attached to the device dies before the device dies are attached to the substrate.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.

Abstract: A multilayer ceramic substrate includes ink channels for routing ink from a reservoir to a plurality of printhead dies. The ceramic substrate serves as a carrier substrate for the dies and as an ink manifold for routing ink. The ceramic substrate also serves to interconnect the printhead dies and provide electrical signal routing.

Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.

Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.

Abstract: A fluid ejecting device with a body defining an array of nozzles. The nozzles are arranged in an array along an array axis. The array has a first portion in which the nozzles are spaced apart along the array axis by a first pitch, and a second portion in which the nozzles are spaced apart by a different second pitch. The array may have a third portion between the first and second portions with a third pitch different from the first and second pitch. An assembly may include two or more of such fluid ejection devices, and the second portion of one print head may be aligned with the first portion of the other print head. Printers incorporating the fluid ejection devices and printing methods are also disclosed.

Abstract: A multilayer ceramic substrate includes ink channels for routing ink from a reservoir to a plurality of printhead dies. The ceramic substrate serves as a carrier substrate for the dies and as an ink manifold for routing ink. The ceramic substrate also serves to interconnect the printhead dies and provide electrical signal routing.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.

Abstract: A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.

Abstract: The present invention is a thermal printhead which includes a substrate portion, a resistive material configured to form a heating element and a thermal barrier island positioned between the resistive material and the substrate portion. The thermal barrier island is defined between the heating element and the substrate portion to reduce the heat flow between the heating element and the substrate portion.