Patents by Inventor Timothy E. Cooper
Timothy E. Cooper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147002Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example system includes: interface circuitry; programmable circuitry; and instructions to program the programmable circuitry to: obtain audio of a media presentation; obtain ambient noise in an area associated with the media presentation; determine an intensity of a difference between the audio and the ambient noise; and determine an engagement level of an audience of the media presentation based on a duration the intensity satisfies a threshold value.Type: ApplicationFiled: October 26, 2022Publication date: May 2, 2024Inventors: James Joseph Vitt, Timothy Scott Cooper, Douglas Brent Turnbow, Troy E. McClellan
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Patent number: 7868632Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.Type: GrantFiled: April 6, 2007Date of Patent: January 11, 2011Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7825674Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: GrantFiled: June 30, 2006Date of Patent: November 2, 2010Assignee: FormFactor, Inc.Inventors: Makarand S. Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy, Benjamin N. Eldridge
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Patent number: 7701243Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.Type: GrantFiled: December 9, 2008Date of Patent: April 20, 2010Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7694246Abstract: A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermined positions relative to landmarks on the carrier base the die pick machine optically identifies. With the dice temporarily held in place on the carrier base, they are subjected to a series of testing and other processing steps. Since each die's signal pads reside in predetermined locations, they can be accessed by appropriately arranged probes providing test equipment with signal access to the pads during tests. After each test, a die pick machine may replace any die that fails the test with another die, thereby improving efficiency of subsequent testing and other processing resources.Type: GrantFiled: June 19, 2002Date of Patent: April 6, 2010Assignee: FormFactor, Inc.Inventors: Charles A. Miller, Timothy E. Cooper, Yoshikazu Hatsukano
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Publication number: 20090134897Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.Type: ApplicationFiled: January 27, 2009Publication date: May 28, 2009Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Carl V. Reynolds, Ravindra Vaman Shenoy
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Publication number: 20090085592Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.Type: ApplicationFiled: December 9, 2008Publication date: April 2, 2009Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7482822Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.Type: GrantFiled: August 1, 2006Date of Patent: January 27, 2009Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Carl V. Reynolds, Ravindra Vaman Shenoy
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Patent number: 7463043Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.Type: GrantFiled: May 15, 2007Date of Patent: December 9, 2008Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7218127Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.Type: GrantFiled: February 18, 2004Date of Patent: May 15, 2007Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7202682Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.Type: GrantFiled: December 20, 2002Date of Patent: April 10, 2007Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Patent number: 7084650Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.Type: GrantFiled: December 16, 2002Date of Patent: August 1, 2006Assignee: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Carl V. Reynolds, Ravindra Vaman Shenoy
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Patent number: 7071715Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: GrantFiled: February 2, 2004Date of Patent: July 4, 2006Assignee: FormFactor, Inc.Inventors: Makarand S. Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy, Benjamin N. Eldridge
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Publication number: 20040130312Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.Type: ApplicationFiled: December 20, 2002Publication date: July 8, 2004Applicant: FormFactor, Inc.Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu
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Publication number: 20040113640Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.Type: ApplicationFiled: December 16, 2002Publication date: June 17, 2004Inventors: Timothy E. Cooper, Benjamin N. Eldridge, Carl V. Reynolds, Ravindra Vaman Shenoy