Patents by Inventor Timothy E. McIntosh

Timothy E. McIntosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded memory and power management subpackage
    Patent number: 9871026
    Abstract: Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: January 16, 2018
    Assignee: Intel Corporation
    Inventors: John S. Guzek, Debendra Mallik, Sasha N. Oster, Timothy E. McIntosh
  • EMBEDDED MEMORY AND POWER MANAGEMENT SUBPACKAGE
    Publication number: 20160197065
    Abstract: Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 11, 2016
    Publication date: July 7, 2016
    Inventors: John S. Guzek, Debendra Mallik, Sasha N. Oster, Timothy E. McIntosh
  • Embedded memory and power management subpackage
    Patent number: 9287248
    Abstract: Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: March 15, 2016
    Assignee: INTEL CORPORATION
    Inventors: John S. Guzek, Debendra Mallik, Sasha N. Oster, Timothy E. McIntosh
  • EMBEDDED MEMORY AND POWER MANAGEMENT SUBPACKAGE
    Publication number: 20150171065
    Abstract: Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 18, 2015
    Inventors: John S. Guzek, Debendra Mallik, Sasha N. Oster, Timothy E. McIntosh