Patents by Inventor Timothy E. Murphy
Timothy E. Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11625900Abstract: A first set of instance layer data that describes a scene to be represented by one or more computer-generated images is obtained. The set of instance layer data specifies a plurality of object instances within the scene, with each instance of the plurality of object instances corresponding to a position that an instance of a digital object is to appear in the scene. The set of instance layer data further specifies a first set of characteristics of the plurality of object instances that includes the position. A second set of instance layer data that indicates changes to be made to the scene described by the first set of instance layer data is obtained. A third set of instance layer data is generated to include the changes to the scene by overlaying the second set of instance layer data onto the first set of instance layer data. The scene is caused to be rendered by providing the third set of instance layer data to an instancing service.Type: GrantFiled: October 22, 2020Date of Patent: April 11, 2023Assignee: Unity Technologies SFInventors: Nick S. Shore, Oliver M. Castle, Timothy E. Murphy
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Publication number: 20140053325Abstract: An athletic protector, such as an athletic cup, with regions formed of the same compositional material, which is more rigid in one such region than in another such region.Type: ApplicationFiled: February 18, 2013Publication date: February 27, 2014Inventors: Timothy E. Murphy, Daniel J. Cram
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Publication number: 20090241968Abstract: An athletic protector, such as an athletic cup, with regions formed of the same compositional material, which is more rigid in one such region than in another such region.Type: ApplicationFiled: October 1, 2008Publication date: October 1, 2009Applicant: Russell CorporationInventors: Timothy E. Murphy, Daniel J. Cram
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Patent number: 6914317Abstract: A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.Type: GrantFiled: August 21, 2003Date of Patent: July 5, 2005Assignee: Micron Technology, Inc.Inventors: Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Jon M. Long, Mark W. Ellis, Vincent L. Riley
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Publication number: 20040038500Abstract: A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.Type: ApplicationFiled: August 21, 2003Publication date: February 26, 2004Inventors: Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Jon M. Long, Mark W. Ellis, Vincent L. Riley
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Patent number: 6693342Abstract: A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.Type: GrantFiled: April 30, 2001Date of Patent: February 17, 2004Assignee: Micron Technology, Inc.Inventors: Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Jon M. Long, Mark W. Ellis, Vincent L. Riley
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Publication number: 20010051415Abstract: A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.Type: ApplicationFiled: April 30, 2001Publication date: December 13, 2001Inventors: Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Jon M. Long, Mark W. Ellis, Vincent L. Riley
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Patent number: 6303469Abstract: A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.Type: GrantFiled: June 7, 2000Date of Patent: October 16, 2001Assignee: Micron Technology, Inc.Inventors: Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Jon M. Long, Mark W. Ellis, Vincent L. Riley
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Patent number: D1016674Type: GrantFiled: September 23, 2022Date of Patent: March 5, 2024Assignee: NATIONAL ASSOCIATION FOR STOCK CAR AUTO RACING, LLCInventors: Brandon Thomas, John Probst, Eric Jacuzzi, Christopher A. Popiela, Timothy S. Murphy, Donald E. Krueger