Abstract: A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ends of the bridgepiece, the legs being shaped in dimensions to mate with complementary apertures in the carrier to releasably lock the bridgepiece to the carrier at a fixed height therefrom; and a plurality of deformable formations on an underside of the bridgepiece in between the legs, the deformable formations being shaped, dimensioned, and positioned to deform when brought to bear against a component in the carrier in a manner that regularly inward forces are applied to the component along at least two intersecting axes, the forces being symmetrically distributed with respect to the component.