Abstract: A trim system for controlling an equivalence ratio in a fuel system is provided. The fuel system includes an air duct, a mixer disposed in the air duct, and a converter. The mixer has a reference pressure port and an air valve vacuum port. The converter has an outlet port and a bias port. The trim system comprises the mixer, the converter, a balance line, one or more orifices, and first and second trim valves. The outlet port is operably coupled to the mixer to deliver vaporized fuel to the mixer. The balance line is operably coupled to the reference pressure port, the bias port, and the air valve vacuum port. The balance line provides pressure to the bias port. The first and second trim valves are disposed in the balance line and operable such that the equivalence ratio in the fuel system is controlled.

Abstract: An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent surfaces under a compressive load, a compression member configured to apply the compressive load to the compliant heat pipe, and wherein the compliant heat pipe conforms to the surface of the compression member and the surface of a heat source under the compressive load. Beneficially, such an apparatus, system, and method would provide efficient heat dissipation through effective thermo-coupling between the heat source and the heat pipe. Additionally, the apparatus, system, and method would facilitate the application of a load to thermal grease for further improvements on thermo-coupling between the heat source and the heat pipe.

Abstract: An apparatus, system, and method are disclosed for thermal conduction interfacing. The apparatus for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The apparatus includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the apparatus includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such an apparatus, system, and method would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the apparatus, system, and method would be modular, reusable, and easy to install or replace without a significant mess.

Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.

Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

Abstract: A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and heat sink before securing the heat sink to the processor package. By pressing the processor package and heat sink together, the tops of the domes flatten out to maximize surface contact between a first side of the sheet and the top of the processor package, and between a second side of the sheet and the top of the heat sink.

Abstract: A thermal interface made up of a sheet having an array of alternating pivoting sections, each section having a first end directed away from a first side of the sheet and a second end directed away from the opposite side of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and heat sink before securing the heat sink to the processor package. By pressing the processor package and heat sink together, the pivoting sections press against the two surfaces of the processor package and the heat sink to provide a mechanical pressure interface that promotes thermal conduction between the surfaces. In a preferred embodiment, the sheet also has alternating side cantilever panels that provide additional pressure contacts.

Abstract: An elastomeric pin isolator assembly is provided, including an elastomeric material, configured to engage a first support structure or mass, and a pin member, engaged with the elastomeric material, the pin member configured to slidably at least one of a second support structure or mass and the elastomeric material, and further wherein at least a portion of the elastomeric member is disposed between and second support structures or masses such that the first and second support structures or masses do not directly contact.

Abstract: A computer system having an opening configured to accept a device, the device assembly including at least one engagement surface. 3The computer system comprises a locking mechanism disposed in the opening to releasably latch the device assembly in the opening at a preselected position. The latching mechanism includes a hand actuated assembly movable in the opening for releasably engaging the engagement surface of the device assembly when the device assembly is located in the opening. The invention also contemplates the combination of the device assembly and the computer.

Abstract: A heat removal system for a computer has a heat sink and a spool rotatably disposed in the heat sink. The spool includes fluid inlets and outlets, and water circulates in a closed loop from the inlets, through the spool, through the outlets, past the computer component to be cooled, and between the heat sink and the spool to transfer heat to the heat sink, then back to the inlets. A thermally conductive can is between the heat sink and spool such that the working fluid flows between the can and spool.