Abstract: A heat shield assembly adapted for use with gas turbine engines, airframes, and aircraft includes a carrier and a heat-shield tile. The carrier is adapted to couple to the gas turbine engine, airframe, or aircraft. The heat-shield tile includes material different than the carrier and is arranged to cover the carrier to protect the carrier from high-temperature gases surrounding the heat shield assembly.

Abstract: A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

Abstract: A bonding probe is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding probe includes a body, an attachment end at a distal end of the body, a head at an opposite end of the body, a tip extending from the head, and a cooling passageway. The attachment end couples the body to a resistance welder. The tip extends to form a proximate end of the body. The tip includes a contacting area having a predetermined three dimensional contoured surface. The contacting area aligns with a predetermined area of a three dimensional outer surface of a cover sheet of a dual walled structure. The cooling passageway provides a passageway for a flow of cooling fluid. The cooling passageway extends through the head, and into the tip.

Abstract: A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.

Abstract: A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

Abstract: A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

Abstract: A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

Abstract: A method of preparing a surface for diffusion bonding comprises contacting a binder material with a discontinuous surface comprising surface regions separated by gaps. The binder material is selectively deposited onto the surface regions and has a sufficient viscosity to form a self-supporting layer without flowing into the gaps. The self-supporting layer of binder material comprises a mass density in a range from about 0.001 g/in2 to about 0.050 g/in2. A braze powder is distributed over the self-supporting layer of binder material, and a predetermined amount of the braze powder is attached to the binder material. The discontinuous surface is then heated to remove the binder material and adhere the braze powder to the discontinuous surface. Thus, a prewet surface with a braze deposit thereon is formed.

Abstract: A heat shield assembly adapted for use with gas turbine engines, airframes, and aircraft includes a carrier and a heat-shield tile. The carrier is adapted to couple to the gas turbine engine, airframe, or aircraft. The heat-shield tile includes material different than the carrier and is arranged to cover the carrier to protect the carrier from high-temperature gases surrounding the heat shield assembly.

Abstract: A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

Abstract: A bonding probe is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding probe includes a body, an attachment end at a distal end of the body, a head at an opposite end of the body, a tip extending from the head, and a cooling passageway. The attachment end couples the body to a resistance welder. The tip extends to form a proximate end of the body. The tip includes a contacting area having a predetermined three dimensional contoured surface. The contacting area aligns with a predetermined area of a three dimensional outer surface of a cover sheet of a dual walled structure. The cooling passageway provides a passageway for a flow of cooling fluid. The cooling passageway extends through the head, and into the tip.

Abstract: A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

Abstract: A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.

Abstract: A method of preparing a surface for diffusion bonding comprises contacting a binder material with a discontinuous surface comprising surface regions separated by gaps. The binder material is selectively deposited onto the surface regions and has a sufficient viscosity to form a self-supporting layer without flowing into the gaps. The self-supporting layer of binder material comprises a mass density in a range from about 0.001 g/in2 to about 0.050 g/in2. A braze powder is distributed over the self-supporting layer of binder material, and a predetermined amount of the braze powder is attached to the binder material. The discontinuous surface is then heated to remove the binder material and adhere the braze powder to the discontinuous surface. Thus, a prewet surface with a braze deposit thereon is formed.

Abstract: A method for welding a gamma-prime precipitation strengthened alloy component. In one aspect the welding process includes preheating the alloy component to minimize the difference in contraction between the weld deposit and the substrate portion of the component during solidification and cooling. The component having a weld that is substantially free of solidification cracking.