Patents by Inventor Timothy G. Wood

Timothy G. Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5536811
    Abstract: A process is disclosed for improving the water-whitening resistance of a pressure sensitive adhesive containing an aqueous latex emulsion and water-soluble ions by removing the water-soluble ions and adjusting the pH of the pressure sensitive adhesive formulation to at least about 6.0. The preferred method of removing the water-soluble ions is to contact either the aqueous latex emulsion, the formulated pressure sensitive adhesive containing the aqueous latex emulsion, or both with ion exchange resin. The product produced by the process is also disclosed.
    Type: Grant
    Filed: November 15, 1993
    Date of Patent: July 16, 1996
    Assignee: Rohm and Haas Company
    Inventor: Timothy G. Wood
  • Patent number: 5286843
    Abstract: A process is disclosed for improving the water-whitening resistance of a pressure sensitive adhesive containing an aqueous latex emulsion and water-soluble ions by removing the water-soluble ions and adjusting the pH of the pressure sensitive adhesive formulation to at least about 6.0. The preferred method of removing the water-soluble ions is to contact either the aqueous latex emulsion, the formulated pressure sensitive adhesive containing the aqueous latex emulsion, or both with ion exchange resin. The product produced by the process is also disclosed.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: February 15, 1994
    Assignee: Rohm and Haas Company
    Inventor: Timothy G. Wood
  • Patent number: 4912169
    Abstract: Adhesive compositions containing a polymeric additive which is polymerized from monomers selected from C.sub.1 -C.sub.20 alkyl and cycloalkyl acrylate, C.sub.1 -C.sub.20 alkyl and cycloalkyl methacrylate, free-radical polymerizable olefinic acids, and optionally other ethylenically unsaturated monomers wherein said polymeric additive has a number average molecular weight less than about 35,000 and a softening point greater than about 40.degree. C.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: March 27, 1990
    Assignee: Rohm and Haas Company
    Inventors: Judith L. Whitmire, Patricia M. Lesko, Timothy G. Wood
  • Patent number: 4820783
    Abstract: A method of forming preceramic polymers using a organopolysilane of the formula [(RSiH).sub.x (RSi).sub.y ].sub.n, where R is a lower alkyl group having from 1 to about 6 carbon atoms, a lower alkenyl group having from 2 to about 6 carbon atoms, a substituted or unsubstituted lower aryl group having from 6 to about 10 carbons atoms, a tri(lower)alkyl- or di(lower)alkylsilyl group and n is an integer greater than 1, and reacting it with alkali metal amides or silylamides in catalytic quantities is disclosed. Preferably, the alkali metal amide is a polymeric alkali metal silylamide of the formula [(R.sup.1 SiHNH).sub.a (R.sup.1 SiN).sub.b (R.sup.1 SiHNM).sub.c ].sub.m where a+b+c=I; R.sup.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: April 11, 1989
    Assignee: Massachusetts Institute of Technology
    Inventors: Dietmar Seyferth, Timothy G. Wood, Yuan-Fu Yu
  • Patent number: 4645807
    Abstract: A method of forming preceramic polymers using a organopolysilane of the formula [(RSiH).sub.x (RSi).sub.y ].sub.n, where R is a lower alkyl group having from 1 to about 6 carbon atoms, a lower alkenyl group having from 2 to about 6 carbon atoms, a substituted or unsubstituted lower aryl group having from 6 to about 10 carbons atoms, a tri(lower)alkyl- or di(lower)alkylsilyl group and n is an integer greater than 1, and reacting it with alkali metal amides or silylamides in catalytic quantities is disclosed. Preferably, the alkali metal amide is a polymeric alkali metal silylamide of the formula [(R.sup.1 SiHNH).sub.a (R.sup.1 SiN).sub.b (R.sup.1 SiHNM).sub.c ].sub.m where a+b+c=1; R.sup.
    Type: Grant
    Filed: July 18, 1985
    Date of Patent: February 24, 1987
    Assignee: Massachusetts Institute of Technology
    Inventors: Dietmar Seyferth, Timothy G. Wood, Yuan-Fu Yu