Patents by Inventor Timothy Gittemeier

Timothy Gittemeier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-power amplifier package
    Patent number: 10700023
    Abstract: Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 30, 2020
    Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
    Inventor: Timothy Gittemeier
  • HIGH-POWER AMPLIFIER PACKAGE
    Publication number: 20190006297
    Abstract: Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
    Type: Application
    Filed: March 26, 2018
    Publication date: January 3, 2019
    Applicant: MACOM Technology Solutions Holdings, Inc.
    Inventor: Timothy Gittemeier
  • High-power amplifier package
    Patent number: 9960127
    Abstract: Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: May 1, 2018
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventor: Timothy Gittemeier
  • HIGH-POWER AMPLIFIER PACKAGE
    Publication number: 20170338194
    Abstract: Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
    Type: Application
    Filed: May 18, 2016
    Publication date: November 23, 2017
    Applicant: M/A-COM Technology Solutions Holdings, Inc.
    Inventor: Timothy Gittemeier
  • ESD PROTECTION AND LIMITER CIRCUIT
    Publication number: 20170126002
    Abstract: Electrostatic discharge protection circuits and methods of operation are described. An ESD circuit may include two circuit branches, each including a transistor, that are arranged to shunt voltage and current between two circuit terminals responsive to an over-voltage condition between the two terminals. A turn-on voltage of each transistor may be set by series-connected diodes.
    Type: Application
    Filed: October 28, 2015
    Publication date: May 4, 2017
    Applicant: MACOM Technology Solutions Holdings, Inc.
    Inventor: Timothy Gittemeier