Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Abstract: A processor module comprises an integrated circuit component attached to a power interposer. One or more voltage regulator modules attach to the power interposer via interconnect sockets and the power interposer routes regulated power signals generated by the voltage regulator modules to the integrated circuit component. Input power signals are provided to the voltage regulator from the system board via straight pins, a cable connector, or another type of connector. The integrated circuit component's I/O signals are routed through the power interposer to a system board via a socket located between the power interposer and the socket. Not having to route regulated power signals from a system board through a socket to an integrated circuit component can result in a system board with fewer layers, which can reduce overall system cost, as well as creating more area available in the remaining layers for I/O signal entry to the socket.

Abstract: An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.

Abstract: Examples are disclosed for converting signals routed through a fabric assembly. In some examples, a connector housing may house a paddle card having a first edge portion coupled to a twin-axial cable having first signal pathways capable of routing first signals to/from a fabric controller integrated with a processor/processor package. The paddle card may have a second edge portion that may couple with an external fabric connector including a second plurality of signal pathways. In some examples, first signals received at the first edge portion may be converted to second signals following a coupling of the second edge portion with the external fabric connector. The second signals may then be routed via the second signal pathways included in and/or coupled with the external fabric connector. Other examples are described and claimed.

Abstract: Examples are disclosed for converting signals routed through a fabric assembly. In some examples, a connector housing may house a paddle card having a first edge portion coupled to a twin-axial cable having first signal pathways capable of routing first signals to/from a fabric controller integrated with a processor/processor package. The paddle card may have a second edge portion that may couple with an external fabric connector including a second plurality of signal pathways. In some examples, first signals received at the first edge portion may be converted to second signals following a coupling of the second edge portion with the external fabric connector. The second signals may then be routed via the second signal pathways included in and/or coupled with the external fabric connector. Other examples are described and claimed.

Abstract: Examples are disclosed for converting signals routed through a fabric assembly. In some examples, a connector housing may house a paddle card having a first edge portion coupled to a twin-axial cable having first signal pathways capable of routing first signals to/from a fabric controller integrated with a processor/processor package. The paddle card may have a second edge portion that may couple with an external fabric connector including a second plurality of signal pathways. In some examples, first signals received at the first edge portion may be converted to second signals following a coupling of the second edge portion with the external fabric connector. The second signals may then be routed via the second signal pathways included in and/or coupled with the external fabric connector. Other examples are described and claimed.

Abstract: Examples are disclosed for converting signals routed through a fabric assembly. In some examples, a connector housing may house a paddle card having a first edge portion coupled to a twin-axial cable having first signal pathways capable of routing first signals to/from a fabric controller integrated with a processor/processor package. The paddle card may have a second edge portion that may couple with an external fabric connector including a second plurality of signal pathways. In some examples, first signals received at the first edge portion may be converted to second signals following a coupling of the second edge portion with the external fabric connector. The second signals may then be routed via the second signal pathways included in and/or coupled with the external fabric connector. Other examples are described and claimed.