Abstract: A dive door and ladder assembly includes a door positioned on the side of a boat, preferably in a rearward or aft position. The dive door is attached to a horizontally oriented hinge on a bottom portion thereof, and opens by pivoting inwardly and downwardly (vertically). When the door is in an open position, the underside of the door is generally in a horizontal plane with the upper surface of the doorway, forming a platform for divers and snorkelers to stand on. The upper surface of the doorway further includes a small hatch that may be opened to reveal a compartment therebelow. A collapsible ladder may be positioned within the compartment, in a collapsed state, and may be pulled upwardly from the compartment and folded over the side of the boat, through the doorway and extended into the water.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.