Patents by Inventor Timothy Hehr

Timothy Hehr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
    Publication number: 20050148180
    Abstract: The present invention relates to exposing a bond pad on a substrate. A bond pad is formed over a silicon substrate with the subsequent formation of a dielectric over the bond pad. A patterned resist is formed, and at least opening is processed to form a sloped sidewall profile. The sloped sidewall profile is subsequently etched and transferred to the dielectric layer, exposing the bond pad.
    Type: Application
    Filed: December 30, 2003
    Publication date: July 7, 2005
    Inventors: Swaminathan Sivakumar, Curtis Ward, Timothy Hehr, Mark Fradkin