Patents by Inventor Timothy Hoepfner

Timothy Hoepfner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070224842
    Abstract: A window pane has a substrate formed from glass and includes an electrical device including an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor. An electrical connector is bonded to the electrical conductor and has a first interacting portion. A terminal is disposed adjacent to the electrical connector and has a second interacting portion for interacting with the first interacting portion to mechanically couple the electrical connector and the terminal. The substrate has a first coefficient of thermal expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10?6/° C. Due to the mechanical coupling between the connector and the terminal, the terminal and connector are less prone to bending, breakage, or delamination than conventional connector structures.
    Type: Application
    Filed: May 30, 2007
    Publication date: September 27, 2007
    Applicant: AGC AUTOMOTIVE AMERICAS R&D, INC.
    Inventors: Timothy Hoepfner, Makoto Sato
  • Publication number: 20070105412
    Abstract: A window pane has a substrate formed from glass and includes an electrical device. The electrical device includes an electrical conductor and an electrical connector. A layer of solderable metal is bonded to the connector. A layer of solder is bonded to the layer of solderable metal and the conductor, with the connector and the conductor in electrical communication through the layer of solderable metal and the layer of solder. The substrate has a first coefficient of expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10?6/° C. for minimizing mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature. The solder is comprised of less than 70 parts by weight of Sn along with a greater than 30 parts by weight of a reaction rate modifier.
    Type: Application
    Filed: January 2, 2007
    Publication date: May 10, 2007
    Applicant: AGC AUTOMOTIVE AMERICAS R&D, INC.
    Inventors: Timothy Hoepfner, Makoto Sato
  • Publication number: 20060105589
    Abstract: A method of bonding a connector to an electrical conductor. The conductor is applied to a glass substrate and the connector is placed over the conductor. An ultrasonic welding apparatus is used to oscillate the connector relative to the conductor to bond the connector to the conductor while maintaining the temperatures of the connector and conductor below the predefined melting points and without damaging the glass substrate. In addition, an electrically conductive foil can be disposed between the connector and the conductor for ensuring electrical communication between the connector and the conductor.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Inventors: Mark Ackerman, Timothy Hoepfner
  • Publication number: 20060102610
    Abstract: A window pane has a substrate formed from glass and includes an electrical device. The electrical device includes an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor. The substrate has a first coefficient of expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10?6/° C. for minimizing mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Inventors: Timothy Hoepfner, Mark Ackerman