Abstract: A removable cable connector engages with an electronic device such that the removable cable connector removably yet securely attaches to the electronic device. In some embodiments, the electronic device includes a plate configured to guide an electronic plug of the removable cable connector toward an electronic receptacle of the electronic device. The plate may be further configured to include one or more locators for holding the electronic receptacle of the electronic device in place. The removable cable connector may include a molded housing formed using a two-shot overmolding process to form a first overmolded strain relief portion and a second overmolded strain relief portion which cover fasteners that fasten a face plate to the connector.

Abstract: An injection device is disclosed comprising a plunger for expressing medicament from a syringe and a delivery mechanism arranged in use to provide a forward biasing force to urge the plunger from a first rearward position to a second forward position to express a dose from the syringe. A latch arrangement is provided that releasably holds the plunger against the force of the delivery mechanism. The latch arrangement comprising at least two resilient segments which define opposing sections of an aperture within which a rearward end of the plunger is retained in the rearward position. A trigger is provided for releasing the plunger in use, the trigger being arranged to outwardly deflect at least one of the resilient segments such that the aperture is expanded to release the rearward end of the plunger. A method of manufacturing the injection device is also enclosed.

Abstract: Ergonomic attachments for a handheld ultrasound probe are described herein. An attachment assembly includes a plate-shaped member that includes a passage configured to accommodate the handheld ultrasound probe such that when the plate-shaped member is inserted in the attachment assembly, a portion of a transducer head of the handheld ultrasound probe protrudes from the plate-shaped member. Another attachment assembly includes a shell that attaches to the handheld ultrasound probe and partially covers the handheld ultrasound probe, and strap anchors that are each connected to the shell and are disposed at opposite ends of the shell. Another attachment includes a curved bar that is continuous between a proximal attachment flange, of the curved bar, that attaches to a first location of the handheld ultrasound probe and a distal attachment flange, of the curved bar, that attaches to a second location of the handheld ultrasound probe.

Abstract: An energy production device may include a core and a heat exchanger positioned over the core. The core may include one or more fuel rods. The core may further include a heat transmission fluid configured to flow through natural convection upwards through the one or more fuel rods and collect heat therefrom. The core may also include a reaction control device including a neutron-absorbing material. The heat exchanger may be configured to receive the heat transmission fluid and transfer the heat to an energy harnessing device positioned on an opposite side of the heat exchanger from the core.

Abstract: A removable cable connector engages with an electronic device such that the removable cable connector removably yet securely attaches to the electronic device. In some embodiments, the electronic device includes a plate configured to guide an electronic plug of the removable cable connector toward an electronic receptacle of the electronic device. The plate may be further configured to include one or more locators for holding the electronic receptacle of the electronic device in place. The removable cable connector may include a molded housing formed using a two-shot overmolding process to form a first overmolded strain relief portion and a second overmolded strain relief portion which cover fasteners that fasten a face plate to the connector.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.

Abstract: The invention encompasses methods of utilizing atomization, methods for forming magnet powders, methods for forming magnets, and methods for forming bonded magnets. The invention further encompasses methods for simulating atomization conditions. In one aspect, the invention includes an atomization method for forming a magnet powder comprising: a) forming a melt comprising R.sub.2.1 Q.sub.13.9 B.sub.