Abstract: An ultrasound probe includes an ultrasound transducer stack, an acoustic lens, and an acoustic coupling layer between the acoustic lens and the ultrasound transducer stack. The transducer stack includes one or more ultrasound transducers emitting an acoustic signal and the acoustic lens focuses the acoustic signal. The acoustic coupling layer has a speed of sound that is higher than a speed of sound in the acoustic lens, and the acoustic coupling layer has a thickness between a quarter and half a wavelength of the acoustic signal.

Abstract: Ergonomic attachments for a handheld ultrasound probe are described herein. An attachment assembly includes a plate-shaped member that includes a passage configured to accommodate the handheld ultrasound probe such that when the plate-shaped member is inserted in the attachment assembly, a portion of a transducer head of the handheld ultrasound probe protrudes from the plate-shaped member. Another attachment assembly includes a shell that attaches to the handheld ultrasound probe and partially covers the handheld ultrasound probe, and strap anchors that are each connected to the shell and are disposed at opposite ends of the shell. Another attachment includes a curved bar that is continuous between a proximal attachment flange, of the curved bar, that attaches to a first location of the handheld ultrasound probe and a distal attachment flange, of the curved bar, that attaches to a second location of the handheld ultrasound probe.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.