Patents by Inventor Timothy J. Chainer

Timothy J. Chainer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190230816
    Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.
    Type: Application
    Filed: March 7, 2019
    Publication date: July 25, 2019
    Inventors: Timothy J. Chainer, Pritish Ranjan Parida, Mark D. Schultz
  • Patent number: 10338024
    Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.
    Type: Grant
    Filed: July 8, 2017
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
  • Patent number: 10238009
    Abstract: Cooling control methods include measuring a temperature of at least one component of each of multiple nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the nodes based on the comparisons.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: March 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Milnes P. David, Madhusudan K. Iyengar, Pritish R. Parida, Robert E. Simons
  • Patent number: 10231359
    Abstract: Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 10231357
    Abstract: An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: March 12, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Milnes P. David, Pritish R. Parida
  • Patent number: 10225952
    Abstract: A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10199309
    Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: February 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Fanghao Yang
  • Patent number: 10194522
    Abstract: A method comprises applying an adhesive to a first substrate and a second substrate to secure the first substrate to the second substrate. The adhesive extends in a plane on one side of an interposer that also extends in the plane, and is contiguous with the adhesive. The interposer comprises openings to enable flow of adhesive through the openings to form adhesive bond areas on one of the substrates where the areas substantially conform to the openings and lie adjacent to adhesive free areas. The adhesive substantially covers the other of the substrates so that the bond areas produce regions of reduced adhesive strength to the one substrate compared to the bond strength of the adhesive to the other substrate. Adjusting opening sizes adjusts area bond strengths. One substrate may comprise a VTM, the other a heat spreader, and the adhesive, a TIM. An article of manufacture comprises the substrate-adhesive-interposer-adhesive-substrate layers.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: January 29, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael Gaynes
  • Publication number: 20180323132
    Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Inventors: Timothy J. Chainer, Pritish R. Parida, Fanghao Yang
  • Publication number: 20180303006
    Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.
    Type: Application
    Filed: May 16, 2018
    Publication date: October 18, 2018
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 10098258
    Abstract: An apparatus for minimizing the volume of coolant leaked in liquid cooled electronic equipment, the apparatus including a server rack, a plurality of closed liquid cooling loops, a plurality of liquid to liquid heat exchangers, and a plurality of pumps. The closed liquid cooling loops are coupled to at least one of the servers in the server rack. Each of the closed liquid cooling loops restricts coolant flow entirely within the server rack. The closed liquid cooling loops may provide the entire volume of coolant provided to each server in the server rack.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 9, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10090226
    Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: October 2, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Fanghao Yang
  • Patent number: 10082849
    Abstract: A computing system includes a first pool of collocated high heat density computing components; a second pool of collocated low heat density computing components; and a reconfigurable switching fabric electrically interconnecting the pools. A first cooling structure is in thermal communication with the first pool; a second cooling structure is in thermal communication with the second pool; and at least one heat rejection unit is in thermal communication with the first cooling structure, the second cooling structure, and at least one heat sink. A controller is configured to obtain a specification of a computing workload; electrically configure at least a portion of the first pool and at least a portion of the second pool to handle the computing workload, by reconfiguring the switching fabric; and select operating parameters for the first and second cooling structures and the at least one heat rejection unit to handle the computing workload.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: September 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10083892
    Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: September 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Fanghao Yang
  • Patent number: 10085367
    Abstract: A method of minimizing the volume of coolant leaked in a liquid cooled electronic system. The method includes detecting a coolant leak in a closed liquid cooling loop from a plurality of closed liquid cooling loops in the server rack. The closed liquid cooling loop may be coupled to at least one server in the server rack. The method may further include identifying the location of the coolant leak in the closed liquid cooling loop of an affected server in the server rack, and powering off a pump, from a plurality of pumps in the server rack, pumping coolant in the closed liquid cooling loop having the coolant leak.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: September 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10045463
    Abstract: Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: August 7, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark E. Steinke
  • Publication number: 20180213685
    Abstract: Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 26, 2018
    Inventors: TIMOTHY J. CHAINER, PRITISH R. PARIDA
  • Publication number: 20180182686
    Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
    Type: Application
    Filed: February 13, 2018
    Publication date: June 28, 2018
    Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
  • Patent number: 9986662
    Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 29, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 9974213
    Abstract: Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 15, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Pritish R. Parida