Patents by Inventor Timothy J. Chainer

Timothy J. Chainer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10908110
    Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: February 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
  • Publication number: 20200396867
    Abstract: A data center cooling system is operated in a first mode, has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and has an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second, different, mode; and, responsive thereto, the data center cooling system is switched to the second mode. The second mode includes at least another of ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion.
    Type: Application
    Filed: July 11, 2020
    Publication date: December 17, 2020
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Publication number: 20200253092
    Abstract: A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.
    Type: Application
    Filed: April 5, 2020
    Publication date: August 6, 2020
    Inventors: Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz
  • Patent number: 10727158
    Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: July 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
  • Patent number: 10727159
    Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: July 28, 2020
    Assignee: International Business Machines Corporatin
    Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
  • Patent number: 10716239
    Abstract: A data center cooling system is operated in a first mode, has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and has an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second, different, mode; and, responsive thereto, the data center cooling system is switched to the second mode. The second mode includes at least another of ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion.
    Type: Grant
    Filed: November 4, 2017
    Date of Patent: July 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10716245
    Abstract: Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: July 14, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10701839
    Abstract: A system, method, and computer product for cooling a server center without the use of vapor compression refrigeration. An example embodiment involves using outdoor ambient air to cool first server components directly and to cool heat exchanges containing liquid used to cool second server components.
    Type: Grant
    Filed: July 29, 2017
    Date of Patent: June 30, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Publication number: 20200154576
    Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.
    Type: Application
    Filed: January 19, 2020
    Publication date: May 14, 2020
    Inventors: Timothy J. Chainer, Michael A. Gaynes
  • Patent number: 10653044
    Abstract: A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: May 12, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz
  • Publication number: 20200118907
    Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 16, 2020
    Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
  • Patent number: 10607963
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 31, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Publication number: 20200091037
    Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
  • Patent number: 10572356
    Abstract: An apparatus comprises a storage controller coupled to at least one multi-region storage device. The at least one multi-region storage device comprises two or more storage regions, the two or more storage regions comprising a first storage region associated with a first set of failure characteristics and at least a second storage region associated with a second set of failure characteristics different than the first set of failure characteristics. The storage controller is configured to replicate in the second storage region at least a portion of data that is stored in the first storage region.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: February 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Bulent Abali, Mohammad Banikazemi, Timothy J. Chainer, James L. Hafner, Dan E. Poff, Krishankumar Rao Surugucchi
  • Patent number: 10563937
    Abstract: A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: February 18, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10559518
    Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: February 11, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Fanghao Yang
  • Patent number: 10548241
    Abstract: An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: January 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Milnes P. David, Pritish R. Parida
  • Patent number: 10548228
    Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: January 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes
  • Publication number: 20200029465
    Abstract: A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 23, 2020
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10528096
    Abstract: A computing system includes a first pool of collocated high heat density computing components; a second pool of collocated low heat density computing components; and a reconfigurable switching fabric electrically interconnecting the pools. A first cooling structure is in thermal communication with the first pool; a second cooling structure is in thermal communication with the second pool; and at least one heat rejection unit is in thermal communication with the first cooling structure, the second cooling structure, and at least one heat sink. A controller is configured to obtain a specification of a computing workload; electrically configure at least a portion of the first pool and at least a portion of the second pool to handle the computing workload, by reconfiguring the switching fabric; and select operating parameters for the first and second cooling structures and the at least one heat rejection unit to handle the computing workload.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: January 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida