Patents by Inventor Timothy J. Fink

Timothy J. Fink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11824336
    Abstract: An outdoor busway system includes one or more conductor sections and one or more electrical connectors such that a conductor section of the outdoor busway system comprises a housing assembly and a conductor set. The housing assembly includes an upper housing section and a lower housing section such that the upper housing section and the lower housing section each having opposing counterposed features to oppose a first separation force of the housing assembly. The conductor set includes a plurality of viscoelastic structural sheets stacked alternatively between a plurality of conductor bars to oppose a second separation force between conductor bars of the plurality of conductor bars.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: November 21, 2023
    Assignee: SIEMENS INDUSTRY, INC.
    Inventors: Steven E. Pever, Timothy J. Fink
  • Publication number: 20230125946
    Abstract: An outdoor busway system includes one or more conductor sections and one or more electrical connectors such that a conductor section of the outdoor busway system comprises a housing assembly and a conductor set. The housing assembly includes an upper housing section and a lower housing section such that the upper housing section and the lower housing section each having opposing counterposed features to oppose a first separation force of the housing assembly. The conductor set includes a plurality of viscoelastic structural sheets stacked alternatively between a plurality of conductor bars to oppose a second separation force between conductor bars of the plurality of conductor bars.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: Steven E. Pever, Timothy J. Fink
  • Patent number: 10714921
    Abstract: A busway tap off system is provided for connecting an electrical supply to a distribution device. The busway tap off system comprises a joint mounted tap box configured for making an electrical connection between an electrical busway and a power distribution system including a downstream panel. The joint mounted tap box is a dynamically mounted electrical equipment and the downstream panel is a rigidly mounted electrical equipment. The busway tap off system further comprises electrical cables that connect the two equipments. The busway tap off system further comprises a nipple accessory that provides a flexible mechanical and electrical connection between the dynamically mounted electrical equipment and the rigidly mounted electrical equipment. The nipple accessory is configured as a rigidly-constructed flexible fitting that includes two axial slides that enable the nipple accessory to move with the dynamically mounted electrical equipment yet remains fixed to the rigidly mounted electrical equipment.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: July 14, 2020
    Assignee: SIEMENS INDUSTRY, INC.
    Inventors: Steven E. Pever, Timothy J. Fink
  • Patent number: 10290986
    Abstract: A multi-bolt joint stack for use in an electrical power distribution system. The joint stack includes (1) a plurality of conductive plate sets, each plate set including a first conductive plate and a second conductive plate separated by a first spacer and a second spacer; (2) a first clamping bolt extending through the plurality of conductive plate sets and the first spacer of each conductive plate set; and (3) a second clamping bolt extending through the plurality of conductive plate sets and the second spacer of each conductive plate set. The first and second clamping bolts are separated from each other to define a plurality of pockets within the joint stack, each pocket being formed by the first and second conductive plates and first and second spacers of the plurality of conductive plate sets. The pockets are configured to receive electrical stabs. Numerous other aspects are provided.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 14, 2019
    Assignee: SIEMENS INDUSTRY, INC.
    Inventors: Steven E. Pever, Timothy J. Fink
  • Publication number: 20190103717
    Abstract: A multi-bolt joint stack for use in an electrical power distribution system. The joint stack includes (1) a plurality of conductive plate sets, each plate set including a first conductive plate and a second conductive plate separated by a first spacer and a second spacer; (2) a first clamping bolt extending through the plurality of conductive plate sets and the first spacer of each conductive plate set; and (3) a second clamping bolt extending through the plurality of conductive plate sets and the second spacer of each conductive plate set. The first and second clamping bolts are separated from each other to define a plurality of pockets within the joint stack, each pocket being formed by the first and second conductive plates and first and second spacers of the plurality of conductive plate sets. The pockets are configured to receive electrical stabs. Numerous other aspects are provided.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Steven E. Pever, Timothy J. Fink
  • Patent number: 9548546
    Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: January 17, 2017
    Assignee: SIEMENS INDUSTRY, INC.
    Inventors: Steven Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
  • Publication number: 20150255887
    Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
    Type: Application
    Filed: May 21, 2015
    Publication date: September 10, 2015
    Inventors: Steven Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
  • Patent number: 9042084
    Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: May 26, 2015
    Assignee: Siemens Industry, Inc.
    Inventors: Steven E. Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
  • Publication number: 20140160638
    Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 12, 2014
    Inventors: Steven E. Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
  • Patent number: 6467398
    Abstract: A method and apparatus for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation. The invention also features an apparatus to carry out the method.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: October 22, 2002
    Assignee: Recot, Inc.
    Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford, James W. Stalder, Kevin Trick
  • Publication number: 20020108501
    Abstract: A method and apparatus for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation. The invention also features an apparatus to carry out the method.
    Type: Application
    Filed: September 10, 2001
    Publication date: August 15, 2002
    Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford, James W. Stalder, Kevin Trick
  • Patent number: 6129939
    Abstract: A method for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation.
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: October 10, 2000
    Assignee: Recot, Inc.
    Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford