Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Abstract: Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.

Abstract: A brake component for retarding a rotor includes a wearable friction segment having a thickness, wherein the friction segment is configured to be pressed into contact with the rotor. The brake component also includes a first resistive sensor having an electric resistance and a feature determinative of the electric resistance. The first resistive sensor is mounted on the friction segment and includes an electric connection for communication with an external device. The feature is configured to wear along with the friction segment thereby increasing the electric resistance of the first resistive sensor. A braking system employing the friction brake component to retard rotation of a wheel and for decelerating a motor vehicle is also disclosed.

Abstract: A brake component for retarding a rotor includes a wearable friction segment having a thickness, wherein the friction segment is configured to be pressed into contact with the rotor. The brake component also includes a first resistive sensor having an electric resistance and a feature determinative of the electric resistance. The first resistive sensor is mounted on the friction segment and includes an electric connection for communication with an external device. The feature is configured to wear along with the friction segment thereby increasing the electric resistance of the first resistive sensor. A braking system employing the friction brake component to retard rotation of a wheel and for decelerating a motor vehicle is also disclosed.

Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.