Abstract: Solution and RIM polymerization of cycloolefins containing at least one norbornene moiety is carried out in the presence of a methathesis catalyst system and an activator, particularly a chlorosilane activator, to obtain faster reaction with higher conversions at lower mold temperatures. The methathesis catalyst system includes an organoammonium molybdate or tungstate catalyst and an alkylaluminum or an alkylaluminum halide cocatalyst. The chlorosilane activator is used at a level of 0.05 to 10 millimoles per mole of the cycloolefin monomers. The polymers of cycloolefins can be impact modified and/or flame-retarded.

Abstract: Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e.g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane-substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.

Abstract: Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e.g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane-substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.

Abstract: Process for polymerizing by ring opening polymerization of a norbornene-type monomer, or a mixture thereof, with or without at least one other polymerizable monomer, in presence of an alkylaluminum halide cocatalyst and an organoammonium molybdate or tungstate catalyst that is soluble in a hydrocarbon reaction solvent and the norbornene-type monomer.