Patents by Inventor Timothy J. Reardon
Timothy J. Reardon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7138016Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 2001Date of Patent: November 21, 2006Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Thomas H. Oberlitner, Craig P. Meuchel, Aleksander Owczarz, Raymon F. Thompson
-
Patent number: 7094291Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 2001Date of Patent: August 22, 2006Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner, Aleksander Owczarz, Raymon F. Thompson
-
Patent number: 6746565Abstract: A semiconductor processing station which utilizes a processing head and processing base which are complementary to enclose a processing chamber. The processing head shown has a rotor with two portions both of which rotate. The rotor has axial movable portions which include a piece holder. The piece holder supports a wafer or other semiconductor piece being processed. The piece holder can be axially extended and retracted relative to a thin membrane which acts as a cover to prevent chemicals from reaching the back side of the wafer during processing.Type: GrantFiled: January 7, 2000Date of Patent: June 8, 2004Assignee: Semitool, Inc.Inventors: Martin C. Bleck, Timothy J. Reardon, Eric J. Bergman
-
Patent number: 6375741Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: May 23, 2000Date of Patent: April 23, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Publication number: 20020040679Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: June 26, 2001Publication date: April 11, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Publication number: 20020038629Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: June 26, 2001Publication date: April 4, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Publication number: 20010050041Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: May 23, 2000Publication date: December 13, 2001Inventors: TIMOTHY J. REARDON, CRAIG P. MEUCHEL, THOMAS H. OBERLITNER
-
Patent number: 6066575Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 1997Date of Patent: May 23, 2000Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Patent number: 6022484Abstract: A semiconductor processing station which utilizes a processing head and processing base which are complementary to enclose a processing chamber. The processing head shown has a rotor with two portions both of which rotate. The rotor has axial movable portions which include a piece holder. The piece holder supports a wafer or other semiconductor piece being processed. The piece holder can be axially extended and retracted relative to a thin membrane which acts as a cover to prevent chemicals from reaching the back side of the wafer during processing.Type: GrantFiled: March 23, 1998Date of Patent: February 8, 2000Assignee: Semitool, Inc.Inventors: Martin C. Bleck, Timothy J. Reardon, Eric J. Bergman
-
Patent number: 5762751Abstract: A semiconductor processing station which utilizes a processing head and processing base which are complementary to enclose a processing chamber. The processing head shown has a rotor with two portions both of which rotate. The rotor has axial movable portions which include a piece holder. The piece holder supports a wafer or other semiconductor piece being processed. The piece holder can be axially extended and retracted relative to a thin membrane which acts as a cover to prevent chemicals from reaching the back side of the wafer during processing.Type: GrantFiled: August 17, 1995Date of Patent: June 9, 1998Assignee: Semitool, Inc.Inventors: Martin C. Bleck, Timothy J. Reardon, Eric J. Bergman
-
Patent number: 5658387Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: April 12, 1995Date of Patent: August 19, 1997Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Patent number: 5431421Abstract: A wafer processor including a wafer support for holding semiconductor wafers. The wafer support member includes wafer gripping fingers mounted in receptacles formed through a wafer support plate. The fingers are angularly displaced to spread the fingers and allow loading of wafers therebetween. The fingers have central cores which are flexibly mounted within a mounting flange by a thin diaphragm. A pivot control supports the cores and carries axial loading. The pivot control members preferably are U-shaped and can serve as connections to an actuator. A locking mechanism is also shown to secure the actuator connection.Type: GrantFiled: March 18, 1992Date of Patent: July 11, 1995Assignee: Semitool, Inc.Inventors: Raymon F. Thompson, Timothy J. Reardon, Aleksander Owczarz
-
Patent number: 5377708Abstract: Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions.Type: GrantFiled: April 26, 1993Date of Patent: January 3, 1995Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Timothy J. Reardon, Raymon F. Thompson, Aleksander Owczarz
-
Patent number: 5357991Abstract: Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions.Type: GrantFiled: April 26, 1993Date of Patent: October 25, 1994Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Timothy J. Reardon, Raymon F. Thompson, Aleksander Owczarz
-
Patent number: 5235995Abstract: Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions.Type: GrantFiled: March 6, 1991Date of Patent: August 17, 1993Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Timothy J. Reardon, Raymon F. Thompson, Aleksander Owczarz