Abstract: A multi-coplanar, multi-layer capacitor array for use as an RFI filter associated with an electrical connector module having a pattern of pin and socket connections includes a multi-layer board structure of super imposed layers including ground plane layers and capacitor layers interleaved with one another. An array of apertures extend vertically through each of the layers forming a grid having a center-to-center spacing and pattern congruent with the apertures in the desired connector module and are configured to receive the conductor pins. The ground plane layers include a continuous conductive layer on top of a dielectric layer with clearance holes surrounding the apertures so as to be electrically insulated from the connector pins and the capacitors.