Abstract: A method of manufacturing an array transducer arrangement, an array transducer arrangement for use in a high temperature environment, a method of manufacturing an array transducer arrangement for use in a high temperature environment, apparatus for selectively emitting ultrasonic waves in a high temperature environment, a method of producing a porous backing layer for a high temperature array transducer arrangement, and a backing layer for an array transducer arrangement are disclosed. The method of manufacturing an array transducer arrangement comprises: providing a piezoelectric layer; arranging a backing layer on a first face of the piezoelectric layer; and cutting a plurality of primary kerfs through the piezoelectric layer and into the backing layer to provide a plurality of piezoelectric elements; whereby the primary kerfs define a pitch of the plurality of piezoelectric elements.

Abstract: A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200° C.

Abstract: A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200° C.