Abstract: Thermal monitoring and analysis of conditions in a power electronic system include sensing of thermal parameters of interest, such as temperature and humidity in an enclosure housing power electronic components. The components are cooled by a liquid coolant flow from a chiller through chiller plates associated with the power electronic components. Air is circulated through the enclosure for heat rejection from the chiller plates. Based on the sensed parameters, factors such as relative humidity and dew point of the cooling air may be computed and evaluated to determine the potential for condensation. Alarms, notices, or recommendations may be output for regulation of the chiller to avoid condensation. The system may also provide for evaluation of installation errors, and degradation of performance over time.

Abstract: Thermal monitoring and analysis of conditions in a power electronic system include sensing of thermal parameters of interest, such as temperature and humidity in an enclosure housing power electronic components. The components are cooled by a liquid coolant flow from a chiller through chiller plates associated with the power electronic components. Air is circulated through the enclosure for heat rejection from the chiller plates. Based on the sensed parameters, factors such as relative humidity and dew point of the cooling air may be computed and evaluated to determine the potential for condensation. Alarms, notices, or recommendations may be output for regulation of the chiller to avoid condensation. The system may also provide for evaluation of installation errors, and degradation of performance over time.