Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: Aspects of the invention include a stutter step press-fit connector insertion process. A non-limiting example of a method includes applying a force to at least one press-fit pin for causing the press-fit pin to move in a direction of a through-hole of a printed circuit board, wherein a value of the force increases as the press-fit pin moves in the direction of the through-hole. In response to detecting contact between the press-fit pin and a surface profile of the through-hole, a first pause of the force is introduced for a pre-determined time interval, wherein the value of the force remains generally static during the pre-determined time interval. The force is reapplied to the press-fit pin upon completion of the time interval, wherein the value of the force increases during the reapplying until the press-fit pin is inserted into the through-hole.

Abstract: A heat sink assembly can comprise a heat sink and a shaping element made of a shape memory material. The shaping element is incorporated into the heat sink assembly in an assembly shape. An actuation energy can cause the shape memory material to change the shaping element to an actuation shape, and the actuation shape can produce a thermal coupling shape in the heat sink. A method comprises forming a shaping element, of a shape memory material, into an actuation shape. The method includes re-forming the shaping element from the actuation shape into an assembly shape and incorporating the shaping element in a heat sink assembly that includes a heat sink. In the method, applying an actuation energy causes the shape memory material to change the shaping element from the assembly shape to the actuation shape to produce a thermal coupling shape in the heat sink.

Abstract: A colloidal silica solution which includes two or more colloidal silica compositions or suspensions having differing particle sizes and specific surface areas, the compositions or suspensions resulting in a multimodal particle size distribution in which the solution or suspension can be bimodal in nature and composed of, but not limited to, particles with a mode of 4 nm and 20 nm or composed of particles 7 nm and 12 nm. The solution or suspension can also be trimodal and composed of, but not limited to, 4 nm, 7 nm and 15 nm or 3 nm, 5 nm, and 20 nm. The solution or suspension can also include other multimodal systems which would give superior water drainage and fiber and ash retention on paper machines. The colloidal silica solution is a drainage and retention aid in the making of paper.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: Aspects of the invention include a stutter step press-fit connector insertion process. A non-limiting example of a method includes applying a force to at least one press-fit pin for causing the press-fit pin to move in a direction of a through-hole of a printed circuit board, wherein a value of the force increases as the press-fit pin moves in the direction of the through-hole. In response to detecting contact between the press-fit pin and a surface profile of the through-hole, a first pause of the force is introduced for a pre-determined time interval, wherein the value of the force remains generally static during the pre-determined time interval. The force is reapplied to the press-fit pin upon completion of the time interval, wherein the value of the force increases during the reapplying until the press-fit pin is inserted into the through-hole.

Abstract: A heat sink assembly can comprise a heat sink and a shaping element made of a shape memory material. The shaping element is incorporated into the heat sink assembly in an assembly shape. An actuation energy can cause the shape memory material to change the shaping element to an actuation shape, and the actuation shape can produce a thermal coupling shape in the heat sink. A method comprises forming a shaping element, of a shape memory material, into an actuation shape. The method includes re-forming the shaping element from the actuation shape into an assembly shape and incorporating the shaping element in a heat sink assembly that includes a heat sink. In the method, applying an actuation energy causes the shape memory material to change the shaping element from the assembly shape to the actuation shape to produce a thermal coupling shape in the heat sink.

Abstract: Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.

Abstract: A colloidal silica solution which includes two or more colloidal silica compositions or suspensions having differing particle sizes and specific surface areas, the compositions or suspensions resulting in a multimodal particle size distribution in which the solution or suspension can be bimodal in nature and composed of, but not limited to, particles with a mode of 4 nm and 20 nm or composed of particles 7 nm and 12 nm. The solution or suspension can also be trimodal and composed of, but not limited to, 4 nm, 7 nm and 15 nm or 3 nm, 5 nm, and 20 nm. The solution or suspension can also include other multimodal systems which would give superior water drainage and fiber and ash retention on paper machines. The colloidal silica solution is a drainage and retention aid in the making of paper.

Abstract: A testing system to test safety interlock switches to ensure that they are operating normally comprising a test loop circuit 16 which connects in series a plurality of safety switches 2, the test loop circuit 16 is adapted to open the switches 2 outputs if broken, the testing system further comprising a diagnostic means 18 which checks each switch to ensure it is operating normally when the test loop circuit 16 is broken. The test loop circuit 16 may be broken when a single switch 2 is activated to open its safety output.

Abstract: A safety interlock switch with coded interlocking to provide tamper resistance, the coded interlocking having two differently coded technologies 8,10; 16,18. In a preferred embodiment one technology is mechanical in the form of a coded-cam system operated by a coded-tongue 8, the other is electronic comprising a non-contact coded RFID sensor 16,18, and wherein the switch is only enabled when the two different codes have been correctly applied.

Abstract: A testing system to test safety interlock switches to ensure that they are operating normally comprising a test loop circuit 16 which connects in series a plurality of safety switches 2, the test loop circuit 16 is adapted to open the switches 2 outputs if broken, the testing system further comprising a diagnostic means 18 which checks each switch to ensure it is operating normally when the test loop circuit 16 is broken. The test loop circuit 16 may be broken when a single switch 2 is activated to open its safety output.

Abstract: A safety interlock switch with coded interlocking to provide tamper resistance, the coded interlocking comprising two differently coded technologies 8,10; 16,18. In a preferred embodiment one technology is mechanical in the form of a coded-cam system operated by a coded-tongue 8, the other is electronic comprising a non-contact coded RFID sensor 16,18, and wherein the switch is only enabled when the two different codes have been correctly applied.

Abstract: A method of removing material from a workpiece by directing a laser beam onto an area of the workpiece and at the same time injecting substantially continuously a stream of high speed (5-300 m/s) solid particles onto the area of the vicinity thereof. The solid particles may be aluminum oxide or zirconium oxide particles having a size in the range of 1-50 &mgr;m. The particle stream is preferably formed coaxially around the laser beam, the particles being accelerated by means such as an inert gas or electrostatic charge which does not work the material. The laser beam melts the material and the solid particles are directed into the molten material before exiting from the face of the material opposite that to which the stream is directed.