Patents by Inventor Timothy John Snyder

Timothy John Snyder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT
    Publication number: 20100098519
    Abstract: A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees.
    Type: Application
    Filed: October 17, 2008
    Publication date: April 22, 2010
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Larry Wayne Shive, Brian Lawrence Gilmore, Timothy John Snyder