Patents by Inventor Timothy Krywanczyk
Timothy Krywanczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7666689Abstract: A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process of directing the particles at the wafer is controlled to stop directing the particles when substantially all of the patterned structures are removed from the wafer. This process also comprises selecting the particles to have a size equal to or less than 3 microns. For example, the particles can comprise aluminum oxide, silicon oxide, cerium, and/or a plastic. By maintaining the particle size equal to 3 microns or less, the blasting produces a substantially smooth wafer surface, thereby omitting the need for subsequent wafer polishing. Further, the wafers produced by such processing do not exhibit the highly stress lattice and fragile nature of wafers processed by wet processing.Type: GrantFiled: December 12, 2006Date of Patent: February 23, 2010Assignee: International Business Machines CorporationInventors: Steven R. Codding, David Domina, James L. Hardy, Timothy Krywanczyk
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Publication number: 20080139088Abstract: A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process of directing the particles at the wafer is controlled to stop directing the particles when substantially all of the patterned structures are removed from the wafer. This process also comprises selecting the particles to have a size equal to or less than 3 microns. For example, the particles can comprise aluminum oxide, silicon oxide, cerium, and/or a plastic. By maintaining the particle size equal to 3 microns or less, the blasting produces a substantially smooth wafer surface, thereby omitting the need for subsequent wafer polishing. Further, the wafers produced by such processing do not exhibit the highly stress lattice and fragile nature of wafers processed by wet processing.Type: ApplicationFiled: December 12, 2006Publication date: June 12, 2008Inventors: Steven R. Codding, David Domina, James L. Hardy, Timothy Krywanczyk
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Publication number: 20080099149Abstract: A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.Type: ApplicationFiled: January 3, 2008Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven Codding, Timothy Krywanczyk, Edward Sprogis, Jocelyn Sylvestre, Matthew Whalen
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Publication number: 20080064185Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.Type: ApplicationFiled: October 29, 2007Publication date: March 13, 2008Applicant: International Business Machines CorporationInventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen
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Publication number: 20070077752Abstract: A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.Type: ApplicationFiled: October 4, 2005Publication date: April 5, 2007Applicant: International Business Machines CorporationInventors: Steven Codding, Timothy Krywanczyk, Edmund Sprogis, Jocelyn Sylvestre, Matthew Whalen
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Publication number: 20070054115Abstract: System and method for applying an adhesive tape or a pressure release tape to a surface of the semiconductor wafer to remove particulate contaminants or foreign material that may have been collected thereon. The pressure-release tape to which the foreign material is adherent is peeled off or removed from the surface of the semiconductor wafer. Advantageously, a pressure-sensitive adhesive tape may be utilized which does not require any intermediate steps between application thereof onto the surface substrate. The adhesive tape provides a novel degree of adhesion to a surface of the substrate compared to the tapes employed in the art, in order to increase the efficiency in removing the foreign materials. Moreover, no residue is left from the pressure-sensitive tape on the surface of the substrate or semiconductor wafer after the step of removing the tape to which the foreign material has adhered.Type: ApplicationFiled: September 8, 2005Publication date: March 8, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven Codding, Petra Klinger-Park, Timothy Krywanczyk
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Publication number: 20070029045Abstract: In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.Type: ApplicationFiled: October 17, 2006Publication date: February 8, 2007Applicant: International Business Machines CorporationInventors: Timothy Krywanczyk, Edmund Sprogis
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Publication number: 20060163204Abstract: A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer comprises an adhesive material. The method includes the step of submerging the tape in a liquid chemical comprising monoethanolamine or an alkanolamine for a pre-specified period of time sufficient to allow for a separation of the tape from the semiconductor substrate without damaging devices on the semiconductor substrate.Type: ApplicationFiled: January 26, 2005Publication date: July 27, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven Codding, Timothy Krywanczyk, Steven Perrotte, Jason Ritter
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Publication number: 20060105547Abstract: A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips.Type: ApplicationFiled: November 16, 2004Publication date: May 18, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David Audette, Steven Codding, Timothy Krywanczyk, Brian Thibault, Matthew Whalen
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Publication number: 20050202678Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.Type: ApplicationFiled: April 28, 2005Publication date: September 15, 2005Applicant: International Business Machines CorporationInventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen
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Publication number: 20050104147Abstract: There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.Type: ApplicationFiled: November 18, 2003Publication date: May 19, 2005Applicant: International Business Machines CorporationInventors: Timothy Krywanczyk, Donald Brouillette, Steven Martel, Matthew Whalen
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Publication number: 20050106879Abstract: In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.Type: ApplicationFiled: November 13, 2003Publication date: May 19, 2005Inventors: Timothy Krywanczyk, Edmund Sprogis
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Publication number: 20050090110Abstract: A structure and method of formation. The substrate has front and back surfaces on opposite sides of the substrate. The substrate has a backside portion extending from the back surface to a second depth into the substrate as measured from the front surface. At least one via is formed in the substrate and extends from the front surface to a via depth into the substrate. The via depth is specific to each via. The via depth of each via is less than an initial thickness of the substrate. The second depth does not exceed the minimum via depth of the via depths. Organic material (e.g., photoresist) is inserted into each via. The organic material is subsequently covered with a tape, followed by removal of the backside portion of the substrate. The tape is subsequently removed from the organic material, followed by removal of the organic material from each via.Type: ApplicationFiled: November 15, 2004Publication date: April 28, 2005Inventors: Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Amye Wells
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Publication number: 20050045591Abstract: A method of treating a molybdenum (moly) mask used in a C4 process to pattern C4 contacts. The moly mask has a wafer side which contacts a wafer during the C4 process and has a rough surface that includes spikes/projections of moly. The moly mask also has a non wafer side and a plurality of holes extending through the mask to pattern C4 contacts in the C4 process. An adhesive layer, such as an adhesive tape, is applied to the non wafer side of the moly mask, to enable a polishing tool to pull a vacuum on the non wafer side of the moly mask in spite of the presence of the holes to secure the moly mask during a subsequent polishing step. The tape also functions as a cushion so that defects on the non wafer side of the moly mask do not replicate through the moly mask to the polished wafer side of the moly mask.Type: ApplicationFiled: August 29, 2003Publication date: March 3, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven Codding, Timothy Krywanczyk, Joseph Danaher, John Malinowski, James Palmer, Melvin Kelly, Caitlin Weinstein, Wolfgang Sauter