Patents by Inventor Timothy L. Hehr

Timothy L. Hehr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterned nanowires
    Patent number: 8409690
    Abstract: Nanowires suspended from a substrate surface and methods of making nanowires suspended from a substrate surface are provided. The suspended nanowires are comprised of a variety of materials, including metals and mixtures of metals. Suspended nanowires supply large surface areas for applications such as, for example, energy storage and catalysis. Embodiments of the invention provide three dimensional nanowires attached to a substrate surface and arrays of three dimensional nanowires.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: April 2, 2013
    Assignee: Intel Corporation
    Inventors: Charles H. Wallace, Matthew L. Tingey, Bradford L. Sun, Timothy L. Hehr
  • PATTERNED NANOWIRES
    Publication number: 20110274882
    Abstract: Nanowires suspended from a substrate surface and methods of making nanowires suspended from a substrate surface are provided. The suspended nanowires are comprised of a variety of materials, including metals and mixtures of metals. Suspended nanowires supply large surface areas for applications such as, for example, energy storage and catalysis. Embodiments of the invention provide three dimensional nanowires attached to a substrate surface and arrays of three dimensional nanowires.
    Type: Application
    Filed: May 7, 2010
    Publication date: November 10, 2011
    Inventors: Charles H. Wallace, Matthew L. Tingey, Bradford L. Sun, Timothy L. Hehr
  • Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
    Publication number: 20050263899
    Abstract: The present invention relates to exposing a bond pad on a substrate. A bond pad is formed over a silicon substrate with the subsequent formation of a dielectric over the bond pad. A patterned resist is formed, and at least opening is processed to form a sloped sidewall profile. The sloped sidewall profile is subsequently etched and transferred to the dielectric layer, exposing the bond pad.
    Type: Application
    Filed: August 11, 2005
    Publication date: December 1, 2005
    Inventors: Swaminathan Sivakumar, Curtis W. Ward, Timothy L. Hehr, Mark A. Fradkin