Patents by Inventor Timothy L. Wells
Timothy L. Wells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11300033Abstract: Systems, devices, methods and programs for reducing emissions from engines are provided. For example, one system for reducing emissions from engines comprises a heating controller coupled to an energy storage device (ESD). The heating controller is configured to control a heating element to heat one or more components of an after-treatment system using energy from the ESD under a first condition and to control the heating element to stop heating the one or more components of the after-treatment system when a second condition is satisfied. Additionally, another system for reducing emissions from engines comprises a controller detecting a decrease in a demanded torque from an engine and an ISG. The controller is then configured to operate a clutch to disengage the engine from the ISG, if after removing fuel from the engine, the sensed speed of the engine is above a threshold.Type: GrantFiled: December 29, 2020Date of Patent: April 12, 2022Assignee: BAE Systems Controls Inc.Inventors: Derek M. Matthews, Timothy L. Wells
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Publication number: 20210115831Abstract: Systems, devices, methods and programs for reducing emissions from engines are provided. For example, one system for reducing emissions from engines comprises a heating controller coupled to an energy storage device (ESD). The heating controller is configured to control a heating element to heat one or more components of an after-treatment system using energy from the ESD under a first condition and to control the heating element to stop heating the one or more components of the after-treatment system when a second condition is satisfied. Additionally, another system for reducing emissions from engines comprises a controller detecting a decrease in a demanded torque from an engine and an ISG. The controller is then configured to operate a clutch to disengage the engine from the ISG, if after removing fuel from the engine, the sensed speed of the engine is above a threshold.Type: ApplicationFiled: December 29, 2020Publication date: April 22, 2021Applicant: BAE Systems Controls Inc.Inventors: Derek M. Matthews, Timothy L. Wells
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Patent number: 10876457Abstract: Systems, devices, methods and programs for reducing emissions from engines are provided. For example, one system for reducing emissions from engines comprises a heating controller coupled to an energy storage device (ESD). The heating controller is configured to control a heating element to heat one or more components of an after-treatment system using energy from the ESD under a first condition and to control the heating element to stop heating the one or more components of the after-treatment system when a second condition is satisfied. Additionally, another system for reducing emissions from engines comprises a controller detecting a decrease in a demanded torque from an engine and an ISG. The controller is then configured to operate a clutch to disengage the engine from the ISG, if after removing fuel from the engine, the sensed speed of the engine is above a threshold.Type: GrantFiled: June 10, 2016Date of Patent: December 29, 2020Assignee: BAE Systems Controls Inc.Inventors: Derek M T Matthews, Timothy L. Wells
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Publication number: 20180171853Abstract: Systems, devices, methods and programs for reducing emissions from engines are provided. For example, one system for reducing emissions from engines comprises a heating controller coupled to an energy storage device (ESD). The heating controller is configured to control a heating element to heat one or more components of an after-treatment system using energy from the ESD under a first condition and to control the heating element to stop heating the one or more components of the after-treatment system when a second condition is satisfied. Additionally, another system for reducing emissions from engines comprises a controller detecting a decrease in a demanded torque from an engine and an ISG. The controller is then configured to operate a clutch to disengage the engine from the ISG, if after removing fuel from the engine, the sensed speed of the engine is above a threshold.Type: ApplicationFiled: June 10, 2016Publication date: June 21, 2018Inventors: Derek MT Matthews, Timothy L. Wells
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Patent number: 7425256Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: September 14, 2007Date of Patent: September 16, 2008Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Patent number: 7288177Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: March 30, 2004Date of Patent: October 30, 2007Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Patent number: 7169313Abstract: A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.Type: GrantFiled: May 13, 2005Date of Patent: January 30, 2007Assignee: Endicott Interconnect Technologies, Inc.Inventors: Norman A. Card, Robert D. Edwards, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak
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Patent number: 7163847Abstract: A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.Type: GrantFiled: October 26, 2005Date of Patent: January 16, 2007Assignee: Endicott Interconnect Technologies, Inc.Inventors: Timothy Antesberger, James W. Fuller, Jr., John J. Konrad, John Kresge, Stephen Krasniak, Timothy L. Wells
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Patent number: 7091066Abstract: A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.Type: GrantFiled: October 27, 2005Date of Patent: August 15, 2006Assignee: Endicott Interconnect Technologies, Inc.Inventors: Timothy Antesberger, James W. Fuller, Jr., John J. Konrad, John Kresge, Stephen Krasniak, Timothy L. Wells
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Patent number: 7084014Abstract: A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.Type: GrantFiled: October 7, 2003Date of Patent: August 1, 2006Assignee: Endicott Interconnect Technologies, Inc.Inventors: Timothy Antesberger, James W. Fuller, Jr., John J. Konrad, John Kresge, Stephen Krasniak, Timothy L. Wells
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Patent number: 7007378Abstract: A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.Type: GrantFiled: December 12, 2002Date of Patent: March 7, 2006Assignee: International Business Machines CorporationInventors: John G. Gaudiello, James D. Herard, John J. Konrad, Jeffrey McKeveny, Timothy L. Wells
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Patent number: 6931722Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.Type: GrantFiled: March 24, 2003Date of Patent: August 23, 2005Assignee: International Business Machines CorporationInventors: Edward L. Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin T. Knadle, John J. Konrad, Joseph A Kotylo, Jeffrey McKeveny, Jose A. Rios, Amit K. Sarkhel, Andrew M. Seman, Timothy L. Wells
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Patent number: 6746578Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: May 31, 2001Date of Patent: June 8, 2004Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Publication number: 20030177635Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.Type: ApplicationFiled: March 24, 2003Publication date: September 25, 2003Inventors: Edward L. Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin T. Knadle, John J. Konrad, Joseph A. Kotylo, Jeffrey McKeveny, Jose A. Rios, Amit K. Sarkhel, Andrew M. Seman, Timothy L. Wells
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Patent number: 6586683Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.Type: GrantFiled: April 27, 2001Date of Patent: July 1, 2003Assignee: International Business Machines CorporationInventors: Edward L. Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin T. Knadle, John J. Konrad, Joseph A. Kotylo, Jeffrey McKeveny, Jose A. Rios, Amit K. Sarkhel, Andrew M. Seman, Timothy L. Wells
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Publication number: 20030102160Abstract: A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.Type: ApplicationFiled: December 12, 2002Publication date: June 5, 2003Applicant: International Business Machines CorporationInventors: John G. Gaudiello, James D. Herard, John J. Konrad, Jeffrey McKeveny, Timothy L. Wells
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Publication number: 20020179450Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: ApplicationFiled: May 31, 2001Publication date: December 5, 2002Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Patent number: 6485892Abstract: Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an external surface of the substrate, forming a predetermined pattern in the photoimageable material, circuitizing the predetermined pattern and then removing both the photoimageable material and the liquid material from the through-holes.Type: GrantFiled: December 17, 1999Date of Patent: November 26, 2002Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Norman A. Card, Jr., Richard Allen Day, Stephen J. Fuerniss, John Joseph Konrad, Jeffrey McKeveny, Timothy L. Wells
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Publication number: 20020157861Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.Type: ApplicationFiled: April 27, 2001Publication date: October 31, 2002Applicant: International Business Machines CorporationInventors: Edward L. Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin T. Knadle, John J. Konrad, Joseph A. Kotylo, Jeffrey McKeveny, Jose A. Rios, Amit K. Sarkhel, Andrew M. Seman, Timothy L. Wells
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Patent number: 6429390Abstract: A wiring board for mounting an electrical device, which has an array of connectors thereon arranged in a grid pattern, wherein the connectors have at least two levels of criticality of connection to the substrate. The substrate has a plurality of mounting structure or features arranged in the same grid pattern to connect with the array of connectors on the electrical device. The mounting structures or features are divided into a plurality of at least two groups, with each group corresponding to a level of criticality of the connectors on the device. Each group of mounting structures has a discernible feature differing from each other group, to thereby permit different levels of inspection criteria for each group.Type: GrantFiled: March 12, 2001Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventors: Michael J. Cummings, Robert J. Lerner, Michael V. Longo, Andrew M. Seman, Raymond C. Tompkins, Timothy L. Wells