Abstract: A device includes: a lead frame having an aperture in a central portion thereof; at least one acoustic transducer mounted on the lead frame above the aperture and configured to convert between acoustic energy and an electrical signal with low signal losses; a housing connected to the lead frame and including a base portion on a same side of the lead frame as the acoustic transducer; an amplifier is provided on a base portion of the housing in close proximity to the acoustic transducer; and a lid configured together with the base portion of the housing to define a cavity, wherein the acoustic transducer and the amplifier are closely positioned within the MEMS device cavity.

Abstract: A device includes: a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate; a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and a dual in-line package having a recess formed therein. The substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and the semiconductor die is disposed between the first side of the substrate and the bottom surface of the recess in the dual in-line package.

Abstract: A packaged device includes a package defining a well having a well top, a die positioned in the well of the package, and a retaining substrate attached to the package over the well top. The retaining substrate holds the die in direct contact with a portion of the package exposed at a well bottom opposite the well top.

Abstract: A micro-electromechanical systems (MEMS) transducer device mounted to a package substrate includes an active transducer having a resonator stack formed over a cavity through a transducer substrate, and a stress mitigation structure between the transducer substrate and the package substrate. The stress mitigation structure reduces stress induced on the transducer substrate due to mismatched coefficients of thermal expansion (CTEs) of the transducer substrate and the package substrate, respectively.

Abstract: A micro-electromechanical systems (MEMS) transducer device comprises: a package substrate having a first coefficient of thermal expansion (CTE); and a transducer substrate comprising a transducer. The transducer substrate is disposed over the package substrate. The transducer substrate has a second CTE that substantially matches the first CTE.

Abstract: A device includes: a housing structure; lid configured together with the housing structure to define a cavity therein; and at least one acoustic transducer disposed within the cavity, wherein the lid shields the at least one acoustic transducer from exposure to electromagnetic interference from electromagnetic radiation originating outside the device. In some embodiments, the housing structure includes some electrically conductive leads, including a ground lead, and the lid is directly connected to the ground lead.

Abstract: A device includes: a lead frame having an aperture in a central portion thereof; at least one acoustic transducer mounted on the lead frame above the aperture and configured to convert between acoustic energy and an electrical signal with low signal losses; a housing connected to the lead frame and including a base portion on a same side of the lead frame as the acoustic transducer; an amplifier is provided on a base portion of the housing in close proximity to the acoustic transducer; and a lid configured together with the base portion of the housing to define a cavity, wherein the acoustic transducer and the amplifier are closely positioned within the MEMS device cavity.

Abstract: A device includes: a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate; a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and a dual in-line package having a recess formed therein. The substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and the semiconductor die is disposed between the first side of the substrate and the bottom surface of the recess in the dual in-line package.

Abstract: A device for manipulating acoustic signals includes a transducer die and a horn. The transducer die is attached to a lead frame and configured to convert between electrical energy and the acoustic signals, the transducer die having a transducer membrane. The horn is integrally connected with the lead frame, the horn extending from the lead frame and having a throat positioned adjacent to the transducer membrane and a mouth opening at an opposite end of the horn from the throat.