Patents by Inventor Timothy Lee Sharp

Timothy Lee Sharp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5932047
    Abstract: A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: August 3, 1999
    Assignee: International Business Machines Corporation
    Inventors: William Louis Brodsky, James Daniel Herard, Thomas George Macek, Timothy Lee Sharp, George Joseph Shovlowsky
  • Patent number: 5731547
    Abstract: A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: March 24, 1998
    Assignee: International Business Machines Corporation
    Inventors: Mark Daniel Derwin, Daniel Peter Labzentis, Jonathan David Reid, Timothy Lee Sharp
  • Patent number: 5703331
    Abstract: A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.
    Type: Grant
    Filed: July 11, 1995
    Date of Patent: December 30, 1997
    Assignee: International Business Machines Corporation
    Inventors: William Louis Brodsky, James Daniel Herard, Thomas George Macek, Timothy Lee Sharp, George Joseph Shovlowsky