Patents by Inventor Timothy Lemke
Timothy Lemke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109850Abstract: The present invention includes compounds of formula (I) and methods for its preparation and treatment of disorders with activated peroxisome preoliferator-activated receptor gamma (PPARG), particularly cancer.Type: ApplicationFiled: August 31, 2023Publication date: April 4, 2024Applicants: Bayer Aktiengesellschaft, The Broad Institute, Inc., Dana-Farber Cancer Institute, Inc.Inventors: Knut EIS, Elisabeth POOK, Ulf BRÜGGEMEIER, Adelaide Clara F. A. DE LEMOS, Sven CHRISTIAN, Isabel Sophie JERCHEL-FURAU, Ulrike RAUH, Nico BRÄUER, Timo STELLFELD, Anders Roland FRIBERG, Christian LECHNER, Stefan KAULFUSS, Hanna MEYER, Charlotte Christine KOPITZ, Steven James FERRARA, Jonathan GOLDSTEIN, Matthew MEYERSON, Christopher LEMKE, Timothy A. LEWIS
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Patent number: 8827746Abstract: An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.Type: GrantFiled: July 30, 2012Date of Patent: September 9, 2014Assignee: Z-Plane, Inc.Inventors: Timothy A. Lemke, Charles C. Byer
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Publication number: 20130034978Abstract: An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.Type: ApplicationFiled: July 30, 2012Publication date: February 7, 2013Inventors: Timothy A. Lemke, Charles C. Byer
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Patent number: 8167630Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.Type: GrantFiled: September 27, 2010Date of Patent: May 1, 2012Assignee: FCI Americas Technology LLCInventors: Timothy A. Lemke, Timothy W. Houtz
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Patent number: 8120926Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.Type: GrantFiled: November 20, 2008Date of Patent: February 21, 2012Assignee: Z-Plane, Inc.Inventors: Timothy A. Lemke, Charles C. Byer
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Patent number: 7927149Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.Type: GrantFiled: December 23, 2009Date of Patent: April 19, 2011Assignee: Z-Plane, Inc.Inventor: Timothy A. Lemke
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Publication number: 20110076897Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.Type: ApplicationFiled: September 27, 2010Publication date: March 31, 2011Inventors: Timothy A. Lemke, Timothy W. Houtz
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Patent number: 7802999Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.Type: GrantFiled: January 12, 2009Date of Patent: September 28, 2010Assignee: FCI Americas Technology LLCInventors: Timothy A. Lemke, Timothy W. Houtz
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Patent number: 7712179Abstract: A convenient ticket scraper is comfortable for use in scraping various surfaces and consists of a main body with a guitar pick shape and an arcuate protruding blade. The main body has a banana shaped key ring hole in one end and the arcuate protruding blade with the thickness of a coin in the other end. There is an even beveled area covered by rubber on each side of the main body for a thumb and a forefinger. An appealing version of this scraper is also disclosed.Type: GrantFiled: May 10, 2007Date of Patent: May 11, 2010Inventor: Patrick Timothy Lemke
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Publication number: 20100099306Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.Type: ApplicationFiled: December 23, 2009Publication date: April 22, 2010Applicant: Z-Plane, Inc.Inventor: Timothy A. Lemke
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Patent number: 7654870Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.Type: GrantFiled: October 17, 2008Date of Patent: February 2, 2010Assignee: Z-Plane, Inc.Inventor: Timothy A. Lemke
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Publication number: 20090201658Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.Type: ApplicationFiled: November 20, 2008Publication date: August 13, 2009Inventors: Timothy A. Lemke, Charles C. Byer
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Publication number: 20090203263Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.Type: ApplicationFiled: October 17, 2008Publication date: August 13, 2009Inventor: Timothy A. Lemke
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Publication number: 20090191731Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.Type: ApplicationFiled: January 12, 2009Publication date: July 30, 2009Inventors: TIMOTHY A. LEMKE, Timothy W. Houtz
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Patent number: 7476110Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.Type: GrantFiled: January 29, 2007Date of Patent: January 13, 2009Assignee: FCI Americas Technology, Inc.Inventors: Timothy A. Lemke, Timothy W. Houtz
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Patent number: 7442054Abstract: An electrical connector according to the invention may include a first signal contact that defines a first side and a first edge, wherein the first side is greater in length than the first edge, the first edge having a first edge width, and a second signal contact that defines a second side and a second edge, wherein the second side is greater in length that the second edge, the second edge having a second edge width. The first signal contact and the second signal contact may be positioned edge-to-edge. A gap may be defined between the first edge of the first signal contact and the second edge of the second signal contact. The gap may have a gap width that is approximately equal to at least one of the first edge width and the second edge width. The connector may have a column pitch, and the gap width may be based on the column pitch. The gap width may be approximately 0.3-0.4 millimeters.Type: GrantFiled: May 27, 2005Date of Patent: October 28, 2008Assignee: FCI Americas Technology, Inc.Inventors: Timothy A. Lemke, Steven E. Minich, Joseph B. Shuey, Gregory A. Hull, Stephen B. Smith
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Publication number: 20080248693Abstract: A shieldless, high-speed electrical connector is disclosed. Such a connector may include a first column of electrical contacts comprising a first arrangement of differential signal pairs separated from one another by first ground contacts, and a second column of electrical contacts adjacent to the first column, the second column of electrical contacts comprising a second arrangement of differential signal pairs separated from one another by second ground contacts. The connector may be devoid of electrical shield plates between the first column of electrical contacts and the second column of electrical contacts. The connector may be capable of transferring differential signals at data transfer rates of at least ten gigabits per second through the connector while producing no more than an acceptable level of cross talk on any of the differential signal pairs.Type: ApplicationFiled: June 17, 2008Publication date: October 9, 2008Applicant: FCI Americas Technology, Inc.Inventors: Clifford L. Winings, Joseph B. Shuey, Timothy A. Lemke, Gregory A. Hull, Stephen B. Smith, Stefaan Hendrik Jozef Sercu, Timothy W. Houtz, Steven E. Minich
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Publication number: 20080214029Abstract: An electrical connector that includes a mass disposed within the connector such that the connector has a first center of gravity in the absence of the mass and a second center of gravity with the mass is disclosed. Such a connector may include a connector housing and an insert molded leadframe assembly (IMLA) positioned within the connector housing. The IMLA may include an array of electrically-conductive contacts and a dielectric leadframe housing overmolded onto the array of contacts. The mass may be disposed within the connector such that the mass causes the connector to be balanced. The connector may be unbalanced about the first center of gravity and balanced about the second center of gravity. The connector may be a right angle, ball grid array connector.Type: ApplicationFiled: January 26, 2007Publication date: September 4, 2008Inventors: Timothy A. Lemke, Timothy W. Houtz
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Publication number: 20080163441Abstract: A convenient ticket scraper is comfortable for use in scraping various surfaces and consists of a main body with a guitar pick shape and an acruate protruding blade. The main body has a banana shaped key ring hole in one end and the acruate protruding blade with the thickness of a coin in the other end. There is an even beveled area covered by rubber on each side of the main body for a thumb and a forefinger. An appealing version of this scraper is also disclosed.Type: ApplicationFiled: May 10, 2007Publication date: July 10, 2008Inventor: Patrick Timothy Lemke
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Patent number: 7390218Abstract: An electrical connector having a leadframe housing, a first electrical contact fixed in the leadframe housing, a second electrical contact fixed adjacent to the first electrical contact in the leadframe housing, and a third electrical contact fixed adjacent to the second electrical contact in the leadframe housing is disclosed. Each of the first and second electrical contacts may be selectively designated, while fixed in the lead frame housing, as either a ground contact or a signal contact such that, in a first designation, the first and second contacts form a differential signal pair, and, in a second designation, the second contact is a single-ended signal conductor. The third electrical contact may be a ground contact having a terminal end that extends beyond terminal ends of the first and second contacts.Type: GrantFiled: December 14, 2006Date of Patent: June 24, 2008Assignee: FCI Americas Technology, Inc.Inventors: Stephen B. Smith, Joseph B. Shuey, Stefaan Hendrik Jozef Sercu, Timothy A. Lemke, Clifford L. Winings