Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiment are also integrated with conventional printed circuit backplanes or be a stand-alone device.

Abstract: An electrical connector having a leadframe housing, a first electrical contact fixed in the leadframe housing, a second electrical contact fixed adjacent to the first electrical contact in the leadframe housing, and a third electrical contact fixed adjacent to the second electrical contact in the leadframe housing is disclosed. Each of the first and second electrical contacts may be selectively designated, while fixed in the lead frame housing, as either a ground contact or a signal contact such that, in a first designation, the first and second contacts form a differential signal pair, and, in a second designation, the second contact is a single-ended signal conductor. The third electrical contact may be a ground contact having a terminal end that extends beyond terminal ends of the first and second contacts.

Abstract: An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array is arranged in a first pattern of signal contacts and ground contacts. The second linear array is arranged in a second pattern of signal contacts and ground contacts that is different from the first pattern. The signal contacts define differential signal pairs. The signal contacts in the first linear array are elongated along a direction along which the first linear array extends.

Abstract: An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array includes a first differential signal pair, a first ground contact lead adjacent to the first differential signal pair, and a second ground contact lead adjacent to the first ground contact lead. The second linear array is positioned adjacent to the first linear array, and includes a second differential signal pair, a third ground contact lead adjacent to the second differential signal pair, and a fourth ground contact lead adjacent to the third ground contact lead. The electrical connector is devoid of electrical shields between the first linear array and the second linear array.

Abstract: An electrical connector that includes a linear array of electrical blade contacts is disclosed. Each contact may have a free-ended mating portion that extends from a mate surface of a dielectric base. The first linear array may include a first signal contact, a second signal contact positioned adjacent to the first signal contact and forming a differential signal pair therewith, and a ground contact positioned adjacent to the second signal contact. The first signal contact, the second signal contact, and the ground contact may each be elongated in a direction along the linear array.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: Lightweight, low-cost, high-density electrical connectors are disclosed that provide impedance-controlled, high-speed, low-interference communications, even in the absence of shields between the contacts, and that provide for a variety of other benefits not found in prior art connectors. An example of such an electrical connector may include a first signal contact positioned within a first linear array of electrical contacts and a second signal contact positioned within a second linear array of electrical contacts that is adjacent to the first linear array. Either of the signal contacts may be a single-ended signal conductor, or one of a differential signal pair. The connector may be devoid of shields between the signal contacts, and of ground contacts adjacent to the signal contacts.

Abstract: Lightweight, low-cost, high-density electrical connectors are disclosed that provide impedance-controlled, high-speed, low-interference communications, even in the absence of shields between the contacts, and that provide for a variety of other benefits not found in prior art connectors. An example of such an electrical connector may include a first signal contact positioned within a first array of electrical contacts and a second signal contact positioned within a second array of electrical contacts that is adjacent to the first linear array. Either of the signal contacts may be a single-ended signal conductor, or one of a differential signal pair. The connector may be devoid of shields between the signal contacts, and of ground contacts adjacent to the signal contacts.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: The present invention provides a shielded circuit board module comprising a conductive frame and conductive cover for substantially shielding an entire circuit board. Apertures are provided in the frame so that connectors on the circuit board are exposed through these apertures rather than shielded by the conductive frame. The assembled conductive frame, cover and circuit board form a shielded circuit board connector module. According to the invention the shielded circuit board connector module can be mated with another circuit board in a parallel configuration. A receptacle frame is preferably mounted on the other circuit board to permit the module to be easily inserted therein so that the circuit boards can be connected. The receptacle frame provides for easy extraction of the module from its connection with another circuit board.

Abstract: A low profile connector is provided by the invention. According to the invention two sets of contacts are secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. A first end of each contact can be coupled to an I/O lead of a printed circuit board and a second end of each contact remains unsupported. A mating low profile connector according to the invention similarly provides two sets of contacts secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. The contacts are compliant and are designed to extend above the mating reference of the connector. The dimensions of the contacts are selected to provide minimum pitch and optimal compliance. A process for making the low profile connector by molding a contract strip into a housing is also disclosed.

Abstract: The present invention provides a shielded circuit board module comprising a conductive frame and conductive cover for substantially shielding an entire circuit board. Apertures are provided in the frame so that connectors on the circuit board are exposed through these apertures rather than shielded by the conductive frame. The assembled conductive frame, cover and circuit board form a shielded circuit board connector module. According to the invention the shielded circuit board connector module can be mated with another circuit board in a parallel configuration. A receptacle frame is preferably mounted on the other circuit board to permit the module to be easily inserted therein so that the circuit boards can be connected. The receptacle frame provides for easy extraction of the module from its connection with another circuit board.

Abstract: A low profile connector is provided by the invention. According to the invention two sets of contacts are secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. A first end of each contact can be coupled to an I/O lead of a printed circuit board and a second end of each contact remains unsupported. A mating low profile connector according to the invention similarly provides two sets of contacts secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. The contacts are compliant and are designed to extend above the mating reference of the connector. The dimensions of the contacts are selected to provide minimum pitch and optimal compliance. A process for making the low profile connector by molding a contract strip into a housing is also disclosed.