Patents by Inventor Timothy Lesher

Timothy Lesher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130321018
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Application
    Filed: May 23, 2013
    Publication date: December 5, 2013
    Applicant: CASCADE MICROTECH, INC.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 8451017
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: May 28, 2013
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Publication number: 20100271060
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Application
    Filed: June 18, 2010
    Publication date: October 28, 2010
    Applicant: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7761986
    Abstract: A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates into the electrical pad, shearing away any oxide on the surface of the pad. The device may then be tested.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: July 27, 2010
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7681312
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: March 23, 2010
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7550984
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: June 23, 2009
    Assignee: Cascade Microtech, Inc.
    Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
  • Patent number: 7400155
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: July 15, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Publication number: 20080054922
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Application
    Filed: October 4, 2007
    Publication date: March 6, 2008
    Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
  • Publication number: 20070283555
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Application
    Filed: July 31, 2007
    Publication date: December 13, 2007
    Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7295025
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: November 13, 2007
    Assignee: Cascade Microtech, Inc.
    Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
  • Publication number: 20070245536
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Application
    Filed: June 21, 2007
    Publication date: October 25, 2007
    Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7266889
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: September 11, 2007
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Publication number: 20070018665
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Application
    Filed: September 27, 2006
    Publication date: January 25, 2007
    Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
  • Patent number: 7138810
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: November 21, 2006
    Assignee: Cascade Microtech, Inc.
    Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
  • Publication number: 20050136562
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Application
    Filed: January 14, 2005
    Publication date: June 23, 2005
    Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Publication number: 20050104610
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 19, 2005
    Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
  • Publication number: 20050088191
    Abstract: A calibration structure for probing devices.
    Type: Application
    Filed: March 5, 2004
    Publication date: April 28, 2005
    Inventor: Timothy Lesher
  • Patent number: 6860009
    Abstract: A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: March 1, 2005
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 6847219
    Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: January 25, 2005
    Assignee: Cascade Microtech, Inc.
    Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
  • Patent number: 6825677
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material islocated within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: November 30, 2004
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy