Patents by Inventor Timothy Lesher
Timothy Lesher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130321018Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: May 23, 2013Publication date: December 5, 2013Applicant: CASCADE MICROTECH, INC.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 8451017Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: June 18, 2010Date of Patent: May 28, 2013Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20100271060Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: June 18, 2010Publication date: October 28, 2010Applicant: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7761986Abstract: A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates into the electrical pad, shearing away any oxide on the surface of the pad. The device may then be tested.Type: GrantFiled: November 10, 2003Date of Patent: July 27, 2010Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7681312Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: July 31, 2007Date of Patent: March 23, 2010Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7550984Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: GrantFiled: October 4, 2007Date of Patent: June 23, 2009Assignee: Cascade Microtech, Inc.Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
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Patent number: 7400155Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: February 3, 2004Date of Patent: July 15, 2008Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20080054922Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: ApplicationFiled: October 4, 2007Publication date: March 6, 2008Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
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Publication number: 20070283555Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: July 31, 2007Publication date: December 13, 2007Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7295025Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: GrantFiled: September 27, 2006Date of Patent: November 13, 2007Assignee: Cascade Microtech, Inc.Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
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Publication number: 20070245536Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: June 21, 2007Publication date: October 25, 2007Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7266889Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: January 14, 2005Date of Patent: September 11, 2007Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20070018665Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: ApplicationFiled: September 27, 2006Publication date: January 25, 2007Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
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Patent number: 7138810Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: GrantFiled: November 12, 2004Date of Patent: November 21, 2006Assignee: Cascade Microtech, Inc.Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
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Publication number: 20050136562Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: January 14, 2005Publication date: June 23, 2005Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20050104610Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: ApplicationFiled: November 12, 2004Publication date: May 19, 2005Inventors: Timothy Lesher, Brad Miller, Clarence Cowan, Michael Simmons, Frank Gray, Cynthia McDonald
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Publication number: 20050088191Abstract: A calibration structure for probing devices.Type: ApplicationFiled: March 5, 2004Publication date: April 28, 2005Inventor: Timothy Lesher
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Patent number: 6860009Abstract: A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.Type: GrantFiled: March 22, 2001Date of Patent: March 1, 2005Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6847219Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.Type: GrantFiled: September 18, 2003Date of Patent: January 25, 2005Assignee: Cascade Microtech, Inc.Inventors: Timothy Lesher, Brad Miller, Clarence E. Cowan, Michael Simmons, Frank Gray, Cynthia L. McDonald
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Patent number: 6825677Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material islocated within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: March 22, 2001Date of Patent: November 30, 2004Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy