Patents by Inventor Timothy Leung

Timothy Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10435468
    Abstract: Disclosed are antibodies, including antibody drug conjugates, that specifically bind to NTB-A. Also disclosed are methods for using the anti-NTB-A antibodies to detect or modulate activity of (e.g., inhibit proliferation of) an NTB-A-expressing cell, as well as for diagnoses or treatment of diseases or disorders (e.g., cancer) associated with NTB-A-expressing cells. Further disclosed is a method of treating multiple myeloma using an anti-NTB-A antibody drug conjugate, which optionally includes an anti-NTB-A antibody as disclosed herein.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: October 8, 2019
    Assignee: Seattle Genetics, Inc.
    Inventors: Timothy S. Lewis, Che-Leung Law
  • Publication number: 20190184029
    Abstract: The present invention is directed to methods for treating cancer comprising administering to a subject in need thereof an auristatin-based antibody drug conjugate and an inhibitor of the PI3K-AKT-mTOR pathway.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 20, 2019
    Inventors: Timothy S. Lewis, Che-Leung Law, Julie A. McEarchern
  • Patent number: 9337354
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: May 10, 2016
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Publication number: 20150315014
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: July 13, 2015
    Publication date: November 5, 2015
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Patent number: 9082883
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 14, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Patent number: 8999757
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: April 7, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
  • Publication number: 20140246738
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: March 4, 2013
    Publication date: September 4, 2014
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
  • Publication number: 20140246739
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: December 27, 2013
    Publication date: September 4, 2014
    Applicant: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Patent number: 8775309
    Abstract: A method and apparatus for providing a competitive bid from a provider comprising receiving billing data from a user, the billing data including provider information, location, and total bill amount. The method further comprising calculating a complex usage pattern based on the billing data and statistical data for the location. The method additionally comprising calculating a competitive bid for the user, based on the complex usage pattern and a pricing structure of the provider.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: July 8, 2014
    Assignee: Siebel Systems, Inc.
    Inventors: Victor Chau, Doug Hoople, Timothy Leung, Kirsty Nuttall, Muralidhar Ravuri, Joshua M. Roper, Peter Sovocool, Balaji Srinivasan, Colette Yee
  • Patent number: 8359301
    Abstract: Embodiments of the present invention relate to aggregating product information from a variety of sources to generate user interfaces that allow users to navigate and discover products. Product information is aggregated from both feed and crawl sources, and product entities are identified within the aggregate product information. In some embodiments, product entities are associated with product classes, and product class detail pages are generated that include product entities within each product class and allow users to view correlations between those produce entities. In some embodiments, relationships are identified between product entities. When a user selects to view information for a given product entity, information is provided indicating similar product entities that have a relationship with the given product entity.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: January 22, 2013
    Assignee: Microsoft Corporation
    Inventors: Imran Aziz, Chi Pong Timothy Leung, Yan-Feng Sun
  • Patent number: 8165959
    Abstract: A method and apparatus for providing a competitive bid from a provider comprising receiving billing data from a user, the billing data including provider information, location, and total bill amount. The method further comprising calculating a complex usage pattern based on the billing data and statistical data for the location. The method additionally comprising calculating a competitive bid for the user, based on the complex usage pattern and a pricing structure of the provider.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: April 24, 2012
    Assignee: Siebel Systems, Inc.
    Inventors: Victor Chau, Doug Hoople, Timothy Leung, Kirsty Nuttall, Muralidhar Ravuri, Joshua M. Roper, Peter Sovocool, Balaji Srinivasan, Colette Yee
  • Publication number: 20120095806
    Abstract: A method and apparatus for providing a competitive bid from a provider comprising receiving billing data from a user, the billing data including provider information, location, and total bill amount. The method further comprising calculating a complex usage pattern based on the billing data and statistical data for the location. The method additionally comprising calculating a competitive bid for the user, based on the complex usage pattern and a pricing structure of the provider.
    Type: Application
    Filed: November 22, 2011
    Publication date: April 19, 2012
    Inventors: Victor Chau, Doug Hoople, Timothy Leung, Kirsty Nuttall, Muralidhar Ravuri, Joshua M. Roper, Peter Sovocool, Balaji Srinivasan, Colette Yee
  • Patent number: 8065229
    Abstract: A method and apparatus for providing a competitive bid from a provider comprising receiving billing data from a user, the billing data including provider information, location, and total bill amount. The method further comprising calculating a complex usage pattern based on the billing data and statistical data for the location. The method additionally comprising calculating a competitive bid for the user, based on the complex usage pattern and a pricing structure of the provider.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: November 22, 2011
    Assignee: Siebel Systems, Inc.
    Inventors: Victor Chau, Doug Hoople, Timothy Leung, Kirsty Nuttall, Muralidhar Ravuri, Joshua M. Roper, Peter Sovocool, Balaji Srinivasan, Colette Yee
  • Patent number: 7741158
    Abstract: An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a mid portion extending through the aperture, a first portion adjacent the first side of the substrate with a cross sectional area larger than the cross sectional area of the aperture and an opposing second portion adjacent the second side of the substrate. One or more semiconductor devices are bonded to the first portion of the heat slug and electrically interconnected to the electrically conductive vias. A heat spreader having a first side and an opposing second side is spaced from the semiconductor devices and generally parallel with the heat slug, whereby the semiconductor devices are disposed between the heat spreader and the heat slug.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: June 22, 2010
    Assignee: Unisem (Mauritius) Holdings Limited
    Inventors: Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio
  • Publication number: 20070284733
    Abstract: An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a mid portion extending through the aperture, a first portion adjacent the first side of the substrate with a cross sectional area larger than the cross sectional area of the aperture and an opposing second portion adjacent the second side of the substrate. One or more semiconductor devices are bonded to the first portion of the heat slug and electrically interconnected to the electrically conductive vias. A heat spreader having a first side and an opposing second side is spaced from the semiconductor devices and generally parallel with the heat slug, whereby the semiconductor devices are disposed between the heat spreader and the heat slug.
    Type: Application
    Filed: May 30, 2007
    Publication date: December 13, 2007
    Inventors: Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio
  • Publication number: 20070260540
    Abstract: A method and apparatus for providing a competitive bid from a provider comprising receiving billing data from a user, the billing data including provider information, location, and total bill amount. The method further comprising calculating a complex usage pattern based on the billing data and statistical data for the location. The method additionally comprising calculating a competitive bid for the user, based on the complex usage pattern and a pricing structure of the provider.
    Type: Application
    Filed: June 24, 2002
    Publication date: November 8, 2007
    Inventors: Victor Chau, Doug Hoople, Timothy Leung, Kirsty Nuttall, Muralidhar Ravuri, Joshua Roper, Peter Sovocool, Balaji Srinivasan, Colette Yee