Patents by Inventor Timothy Levine

Timothy Levine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for treating a deposited film for resistivity reduction
    Patent number: 6319728
    Abstract: A method for reducing the resistivity of a copper layer on a wafer. A moisture containing seed layer of copper is formed over a layer of material on a wafer. The copper seed layer is treated by either heat or ions from a plasma to anneal out moisture thereby reducing its resistivity and improving its adhesion to the underlying layer. A moisture free copper layer is then deposited on top of the “clean” or treated copper seed layer.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: November 20, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Mohan K. Bhan, Ling Chen, Bo Zheng, Justin Jones, Seshadri Ganguli, Timothy Levine, Samuel Wilson, Mei Chang