Abstract: Semiconductor packages and more particularly mounting arrangements for semiconductor packages and related methods are disclosed. Mounting arrangements include metal pads on substrates and selectively placed solder material on various portions of the metal pads. Semiconductor packages may be initially positioned on the solder material and on portions of the metal pads. During solder reflow, the solder material may spread along portions of the metal pads that were previously uncovered by the solder material and effectively move the semiconductor packages. Specific arrangements of metal pad and selective solder material patterns may be provided that control directions of such movements during reflow. Resulting mounting positions of semiconductor packages may be provided with spacings that are closer than limits of pick and place equipment used to initially position the semiconductor packages.