Abstract: A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.

Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.

Abstract: Disclosed is a system for priming a fluid jetting device. The system includes a fluid trench configured within a fluid jetting chip of the fluid jetting device and at least one first channel fluidly coupled to the fluid trench. The at least one first channel extends vertically between the fluid jetting chip and a mounting unit adapted to support the fluid jetting chip, and is adapted to supply a priming fluid to the fluid trench. The system further includes at least one second channel fluidly coupled to the fluid trench. The at least one second channel extends vertically between the fluid jetting chip and the mounting unit, and is adapted to drain-out the priming fluid from the fluid trench. Further disclosed are systems for priming a fluid jetting device, in accordance with various embodiments of the present disclosure.

Abstract: Disclosed is a system for priming a fluid jetting device. The system includes a fluid trench configured within a fluid jetting chip of the fluid jetting device and at least one first channel fluidly coupled to the fluid trench. The at least one first channel extends vertically between the fluid jetting chip and a mounting unit adapted to support the fluid jetting chip, and is adapted to supply a priming fluid to the fluid trench. The system further includes at least one second channel fluidly coupled to the fluid trench. The at least one second channel extends vertically between the fluid jetting chip and the mounting unit, and is adapted to drain-out the priming fluid from the fluid trench. Further disclosed are systems for priming a fluid jetting device, in accordance with various embodiments of the present disclosure.

Abstract: Methods for licensing functionality after an initial transaction are provided. One such method is directed to licensing after an initial transaction of a customer obtaining a supply item including the step of prompting the customer to acquire a usage license for the supply item.

Abstract: Methods for licensing functionality after an initial transaction are provided. One such method is directed to licensing after an initial transaction of a customer obtaining a supply item including the step of prompting the customer to acquire a usage license for the supply item.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

Abstract: Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.

Abstract: A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.

Abstract: A pagewide array of inkjet printheads arranged to reduce nozzle offset. The row of nozzles of each printhead are formed adjacent an edge of the semiconductor chip. Each alternate printhead chip is rotated 180 degrees with regard to its neighbor, thereby reducing the nozzle offset. A smaller nozzle offset minimizes the dot displacement error should the print medium be skewed with respect to the array of printheads.

Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.

Abstract: Methods for licensing functionality after an initial transaction are provided. One such method is directed to licensing after an initial transaction of a customer obtaining a supply item including the step of prompting the customer to acquire a usage license for the supply item.

Abstract: A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.

Abstract: Electroluminescent (EL) displays, media, and members, and methods associated therewith. One such display includes an EL material, conductor layers, and a reflective image formed by a pattern of imaging substance applied adjacent at least one of the conductor layers. The EL material is between at least two of the conductor layers, and at least one of the conductor layers is applied adjacent the EL material in a pattern to form a conductive image. Upon application of an operational potential to the at least two of the conductor layers having the EL material therebetween, the display can be illuminated in an area corresponding to the conductive image.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.

Abstract: A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.

Abstract: Methods for licensing functionality after an initial transaction are provided. One such method is directed to licensing after an initial transaction of a customer obtaining a supply item including the step of prompting the customer to acquire a usage license for the supply item.

Abstract: Embodiments of the invention provide printing incentive methods and systems. In one embodiment, a method of providing advertising content to a customer can be provided. The method can include receiving information associated with a customer. In addition, the method can include receiving information associated with at least one advertiser. Furthermore, the method can include associating at least one keyword with the at least one advertiser. Moreover, the method can include comparing the at least one keyword to a portion of information associated with the customer. Further, the method can include outputting advertising content to the customer based at least in part on the comparison.