Patents by Inventor Timothy Lyon

Timothy Lyon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12648195
    Abstract: Techniques are provided herein to form semiconductor devices that have their semiconductor subfins removed and replaced with one or more dielectric materials. A semiconductor device includes a gate structure around or otherwise on a semiconductor region. A lower end of the semiconductor material includes a subfin adjacent to a dielectric layer that acts as shallow trench isolation (STI) between semiconductor devices. A backside process may be performed to remove the bulk substrate and expose a bottom surface of the subfin. The subfin may then be removed from the backside to form backside recesses. A dielectric liner may be formed within the backside recesses and a dielectric fill may be formed within a remaining volume of the backside recesses. Replacing the subfins with dielectric materials may lower parasitic capacitance between the subfins and the gate electrodes as well as reduce parasitic current between adjacent source or drain regions.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: June 2, 2026
    Assignee: INTEL CORPORATION
    Inventors: Giorgio Mariottini, Jamie Wilt, Anbusathaiah Varatharajan, Jaladhi Mehta, Alexander Kane, Amish B. Shah, Weihong Gao, Aurelia Chi Wang, Conor P. Puls, Claire Mcghee, Sayan Sarkar, Eric Young, Timothy Lyon, Chun-Kuo Huang, Warren Gray, Angel R. Aquino Gonzalez, Daniel J. Harris
  • Publication number: 20260075894
    Abstract: Techniques are provided herein to form semiconductor devices that have their semiconductor subfins removed and replaced with one or more dielectric materials. A semiconductor device includes a gate structure around or otherwise on a semiconductor region. A lower end of the semiconductor material includes a subfin adjacent to a dielectric layer that acts as shallow trench isolation (STI) between semiconductor devices. A backside process may be performed to remove the bulk substrate and expose a bottom surface of the subfin. The subfin may then be removed from the backside to form backside recesses. A dielectric liner may be formed within the backside recesses and a dielectric fill may be formed within a remaining volume of the backside recesses. Replacing the subfins with dielectric materials may lower parasitic capacitance between the subfins and the gate electrodes as well as reduce parasitic current between adjacent source or drain regions.
    Type: Application
    Filed: June 30, 2023
    Publication date: March 12, 2026
    Applicant: Intel Corporation
    Inventors: Giorgio Mariottini, Jamie Wilt, Anbusathaiah Varatharajan, Jaladhi Mehta, Alexander Kane, Amish B. Shah, Weihong Gao, Aurelia Chi Wang, Conor P. Puls, Claire Mcghee, Sayan Sarkar, Eric Young, Timothy Lyon, Chun-Kuo Huang, Warren Gray, Angel R. Aquino Gonzalez, Daniel J. Harris
  • Patent number: 7634932
    Abstract: A key fob for a vehicle has a first end that is used as a key for insertion into a vehicle ignition receptacle and a second end that defines an opening for internal storage of a separate, removable key. While the key fob will remotely unlock the vehicle doors and start the vehicle engine when turned in the vehicle ignition, the removable key is an auxiliary, mechanical access key that may be used on door locks and interior storage compartments. The key fob will not unlock interior storage compartments and the removable key will not sustain operation of the vehicle engine.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: December 22, 2009
    Assignee: Chrysler Group LLC
    Inventors: Mariano Cadiz, James A. Willyard, Timothy Lyon, Steve Holmes, Edward Pinardi
  • Publication number: 20080127693
    Abstract: A key fob for a vehicle has a first end that is used as a key for insertion into a vehicle ignition receptacle and a second end that defines an opening for internal storage of a separate, removable key. While the key fob will remotely unlock the vehicle doors and start the vehicle engine when turned in the vehicle ignition, the removable key is an auxiliary, mechanical access key that may be used on door locks and interior storage compartments. The key fob will not unlock interior storage compartments and the removable key will not sustain operation of the vehicle engine.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Mariano Cadiz, James A. Willyard, Timothy Lyon, Steve Holmes, Edward Pinardi