Abstract: A method for fabricating a shallow trench isolation structure is described, in which a bottom pad oxide layer, a middle silicon nitride layer, a middle oxide layer and a top silicon nitride layer are sequentially formed on a silicon substrate. Photolithographic masking and anisotropic etching are then conducted to form a trench in the substrate. An oxide material is then deposited on top of the top silicon nitride layer, filling up the trenches at the same time. A chemical mechanical polishing step is then employed to remove the oxide material by using the top silicon nitride layer as a barrier layer. The top silicon nitride layer is then removed, followed by an isotropic etch of the oxide layer below. With the middle nitride layer acting as a natural etch stop, the oxide material is sculpted to a desirable shape. The middle nitride layer and the pad oxide layer are subsequently removed to complete the fabrication of a shallow trench isolation structure.

Abstract: A method for fabricating a shallow trench isolation structure is described, in which a bottom pad oxide layer, a middle silicon nitride layer, a middle oxide layer and a top silicon nitride layer are sequentially formed on a silicon substrate. Photolithographic masking and anisotropic etching are then conducted to form a trench in the substrate. An oxide material is then deposited on top of the top silicon nitride layer, filling up the trenches at the same time. A chemical mechanical polishing step is then employed to remove the oxide material by using the top silicon nitride layer as a barrier layer. The top silicon nitride layer is then removed, followed by an isotropic etch of the oxide layer below. With the middle nitride layer acting as a natural etch stop, the oxide material is sculpted to a desirable shape. The middle nitride layer and the pad oxide layer are subsequently removed to complete the fabrication of a shallow trench isolation structure.