Abstract: The system and method for a heterogeneous integrated circuit packaging method having an air-cavity lid to protect the active face of an integrated circuit, or other device, either active or passive, from the environment. The packaging is hermetic or near hermetic. In some examples, the cover provides electrical routing. In some examples, the cover also provides electromagnetic shielding. In some cases, an encapsulant and/or an overmoulding is provided to further protect the heterogeneous integrated circuit.

Abstract: The system and method for a chip-scale surface-mount technology (SMT) packaging method for semiconductor devices. The chip-scale SMT package uses an air-cavity lid to protect the active face of a MMIC, or other device either active or passive, from the environment. In some examples, the cover provides electrical routing. In some examples, the cover also provides electromagnetic shielding. In some cases, the Au semiconductor devices bond pads which are converted to a Pb/Sn compatible metal.

Abstract: An analog transceiver having low latency for processing a received RF/MW signal and modifying the received RF/MW signal into a modified RF/MW signal prior to transmission of the modified RF/MW signal. The analog transceiver comprises a receiving antenna; a direct conversion receiver, coupled with the receiving antenna, for splitting the received RF/MW signal into an in-phase portion and a quadrature portion; an analog signal processing device, having a plurality of actuatable switches, for modifying the in-phase and quadrature portions and outputting modified signals while only introducing minimal latency during processing; a direct conversion transmitter, for receiving the suitably modified in-phase and quadrature portions and forming the modified RF/MW signal; and a transmitting antenna for receiving the modified RF/MW signal and transmitting the modified RF/MW signal.

Abstract: A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module, a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.

Abstract: A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

Abstract: An integrated DC power delivery system for PCBs is disclosed. In one embodiment, the system includes a compliant mechanical coupling assembly. The system further includes a power distribution interface having power planes configured to receive the DC power via the complaint mechanical coupling assembly upon securing the compliant mechanical coupling to the power distribution interface to provide the needed mechanical support.

Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.

Abstract: An integrated DC power delivery system for PCBs is disclosed. In one embodiment, the system includes a compliant mechanical coupling assembly. The system further includes a power distribution interface having power planes configured to receive the DC power via the complaint mechanical coupling assembly upon securing the compliant mechanical coupling to the power distribution interface to provide the needed mechanical support.