Abstract: A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.

Abstract: A method for the fabrication of a heat transfer member for use with electronic or microwave systems is described. The thermal heat transfer member is a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The method involves molding epoxy matrix material along with conductive graphite fibers and filler material in predetermined geometries. The molded member is then formed in a manner such that the fiber ends are cleanly exposed at the surface of the member in predetermined locations. Metal caps may be formed over the fiber ends to improve heat transfer. Heat is transferred into the member, along the commonly directed fibers, then out of the member at a heat output surface.

Abstract: A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.

Abstract: A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member is which elongated high thermal conductivity fibers are disposed within a matrix material. The matrix material may be an insulating epoxy or thermoplastic resin, while the fibers are elongated continuous commonly directed graphite fibers. The fiber ends terminate at a thermal contact surface which is interfaced with a heat sink. The thermal contact surface may be the transverse edge of the planar member or can be substantially parallel to the planar member. The fiber ends are inclined at an angle with respect to the plane of the planar member to provide for termination of the fibers at the thermal contact surface parallel to the planar member. Heat into the composite member is transferable along the commonly directed graphite fibers.

Abstract: A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The matrix material may be an insulating epoxy or thermoplastic resin, while the fibers are elongated continuous commonly directed graphite fibers. The fiber ends terminate at a thermal contact surface which is interfaced with a heat sink. The thermal contact surface may be the transverse edge of the planar member or can be substantially parallel to the planar member. The fiber ends are inclined at an angle with respect to the plane of the planar member to provide for termination of the fibers at the thermal contact surface parallel to the planar member. Heat into the composite member is transferable along the commonly directed graphite fibers.

Abstract: A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.