Abstract: A matching technique that may be used with electrically small antennas uses one or more digital circuit blocks connected in a feedback arrangement configured to tune the transfer function response between the antenna and an output port of the system. Each circuit block may include an analog-to-digital converter (ADC), a digital filter, and a digital-to-analog converter (DAC). As such, tuning the transfer function may be achieved by sensing a voltage or current at various circuit nodes using one or more ADCs, filtering the measurements in response-shaping digital filters, and using one or more DACs to drive other circuit nodes in a manner that elicits a desired circuit response. Techniques are provided for allowing a matched antenna to adapt to a changing environment about the antenna. In one illustrative embodiment, the digital circuit blocks may be provided as digital non-Foster circuit blocks.

Abstract: A semiconductor structure includes a substrate having first and second opposing surfaces and a plurality of electrical connections extending between the first and second surfaces. The semiconductor structure also includes one or more interconnect pads having first and second opposing surfaces and one or more sides. The first surface of each one of the interconnect pads is disposed over or beneath select portions of at least the second surface of the substrate and is electrically coupled to select ones of the plurality of electrical connections. The semiconductor structure additionally includes an isolating layer having first and second opposing surfaces and openings formed in select portions of the isolating layer extending between the second surface of the isolating layer and the second surfaces of the interconnect pads. A corresponding method for fabricating a semiconductor structure is also provided.

Abstract: A semiconductor structure includes a substrate having first and second opposing surfaces and a plurality of electrical connections extending between the first and second surfaces. The semiconductor structure also includes one or more interconnect pads having first and second opposing surfaces and one or more sides. The first surface of each one of the interconnect pads is disposed over or beneath select portions of at least the second surface of the substrate and is electrically coupled to select ones of the plurality of electrical connections. The semiconductor structure additionally includes an isolating layer having first and second opposing surfaces and openings formed in select portions of the isolating layer extending between the second surface of the isolating layer and the second surfaces of the interconnect pads. A corresponding method for fabricating a semiconductor structure is also provided.

Abstract: A matching technique that may be used with electrically small antennas uses one or more digital circuit blocks connected in a feedback arrangement configured to tune the transfer function response between the antenna and an output port of the system. Each circuit block may include an analog-to-digital converter (ADC), a digital filter, and a digital-to-analog converter (DAC). As such, tuning the transfer function may be achieved by sensing a voltage or current at various circuit nodes using one or more ADCs, filtering the measurements in response-shaping digital filters, and using one or more DACs to drive other circuit nodes in a manner that elicits a desired circuit response. Techniques are provided for allowing a matched antenna to adapt to a changing environment about the antenna. In one illustrative embodiment, the digital circuit blocks may be provided as digital non-Foster circuit blocks.